Dicing-die bonding film
AssigneeNitto Denko Corporation
InventorsYuzo Akada, Koji Akazawa, Keiji Nakamoto
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Abstract
A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.
Claims1
A process for dicing-die bonding comprising the steps of:
- bonding a semiconductor wafer to an adhesive layer of a dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, said pressure-sensitive adhesive layer having been partly ultraviolet-cured,
- cutting the wafer together with the adhesive layer of the dicing-die bonding film to form chips,
- irradiating ultraviolet light on the entire area of the ultraviolet-curable pressure-sensitive adhesive layer through the ultraviolet-transmitting substrate to reduce or eliminate the adhesiveness of the pressure-sensitive adhesive layer to the adhesive layer provided thereon,
- and releasing and picking up the separated chips with the adhesive layer on it from the pressure-sensitive adhesive layer and adhering the chips to an adherend via the adhesive layer.
Dependencies are inferred from the claim text.