Shield assembly for semiconductor wafer supports
AssigneeApplied Materials, Inc.
InventorsPeter R. Jaffe, Kevin Fairbairn
Life of this patent
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Abstract
A method for preventing cross-contamination of semiconductor wafers during processing comprising covering a surface portion of a support assembly with a process compatible material, engaging a semiconductor wafer with the support assembly, processing the wafer while it is engaged with the support member, and removing the process compatible material from the support assembly after said material is considered to be contaminated. A shield particularly adapted for this process includes a shield portion made from a process compatible material and a process-compatible adhesive for attaching the shield portion to the support assembly.
Claims8
An implantation shield for an ion implantation machine comprising:
- a shielding member made from a process compatible material;
- and
- a vacuum compatible adhesive for attaching said shielding member to a surface of an ion implantation machine wafer support which is to be shielded during an ion implantation process, said adhesive able to be stripped from said support when the shield becomes contaminated.
Dependencies are inferred from the claim text.