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US 5,475,920 AGranted
Method of assembling ultra high density integrated circuit packages
OwnerCarmen D. Burns, Jerry M. Roane +1inventors
InventorsCarmen D. Burns, Jerry M. Roane, James W. Cady
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Abstract
A method and apparatus for providing a multiple-element ultra high density level-two integrated circuit modular package utilizing a temporary manufacturing fixture to achieve a stack of individual thin ultra high density integrated circuit packages.
Claims11
A method of manufacturing an ultra high density integrated circuit package, comprising the steps of:
- (a) providing a plurality of level-one integrated circuit packages of the type including an integrated circuit element formed in a silicon substrate, and a casing surrounding said integrated circuit element, said casing having an upper and a lower surface and a perimeter wall;
- and
- wherein said integrated circuit element includes a plurality of electrical interconnect leads extending from said silicon substrate through a portion of said perimeter wall;
- (b) providing a temporary fixture for receiving a plurality of electrically conductive rails adapted for electrical connection to said leads extending from said level-one packages;
- (c) inserting said rails into said temporary fixture;
- (d) mounting a cap member to said rails;
- (e) inserting a plurality of level-one packages into said fixture to form a stack, wherein said leads of said level-one packages are aligned with said rails;
- (f) extracting said stack from said fixture;
- and
- (g) electrically connecting at least some of said leads to said rails.
7 more elements
A method of manufacturing an ultra high density integrated circuit package, comprising the steps of:
- (a) providing a plurality of level-one integrated circuit packages of the type including an integrated circuit element formed in a silicon substrate, and a casing surrounding said integrated circuit element, said casing having an upper and a lower surface and a perimeter wall;
- and
- wherein said integrated circuit element includes a plurality of electrical interconnect leads extending from said silicon substrate through a portion of said perimeter wall;
- (b) providing a temporary fixture for receiving a plurality of electrically conductive rails adapted for electrical connection to said leads extending from said level-one packages;
- (c) inserting said rails into said temporary fixture;
- (d) mounting a cap member to said rails in said fixture;
- (e) inserting a first level-one package into said fixture;
- (f) repeating step (e) for second and subsequent level-one packages so that a stack of level-one packages is formed;
- (g) extracting said stack of level-one packages from said temporary fixture;
- (h) securing said stack together;
- and
- (i) electrically connecting at least some of said leads of said level-one packages to said rails.
9 more elements
Dependencies are inferred from the claim text.