Method of preventing deformation of lead frames
AssigneeElectroplating Engineers of Japan Limited
InventorsTsuneo Kubota, Kazuhiro Taniguchi
Life of this patent
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Abstract
Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step.
Claims10
A method of preventing deformation of a lead frame, which comprises:
- defining, on a lead frame, to-be-nonplated portions around to-be-plated portions respectively, said to be plated portions including pin tips and die pads on which chips are to be mounted;
- providing, on an adhesive tape or a resin film to be applied to said lead frame, covering surface portions corresponding to profile of said to-be-nonplated portions of said lead frame, and openings which locate in said covering surface portions corresponding to a profile of said to-be-plated portions of said lead frame, respectively;
- and
- applying said adhesive tape or resin film to said lead frame prior to plating treatment, followed by a plating treatment of said to-be-plated portions exposed through said opening.
A method of preventing deformation of a lead frame, which comprises:
- covering to-be-nonplated portions of a lead frame beforehand with an adhesive tape or a resin film;
- and
- applying a plating treatment to to-be-plated portions of said lead frame;
- wherein said adhesive tape or resin film is formed by a heat-resistant resin, which is not peeled after completion of said plating treatment but embedded in a resin molding when said lead frame is subjected to a resin molding treatment.
A method of preventing deformation of a lead frame, wherein said lead frame is prevented from being deformed in a series of treatment processes from plating treatment to resin molding provided on said lead frame having die pads, to-be-plated portions, and to-be-nonplated portions, said to-be-plated portions including pin tips which are located around said die pads, said to-be-nonplated portions being located around said to-be-plated portions, said method comprising the steps of:
- applying a heat-resistant adhesive tape or resin film onto said lead frame prior to plating treatment, said adhesive tape or resin film having covering surface portions corresponding to the profile of said to-be-nonplated portions, and openings corresponding to the profile of said to-be-plated portions, to thereby allow said to-be-plated portions to be exposed through said openings and to provide said lead frame with a state that said to-be-nonplated portions are covered with said covering surface portions;
- and
- providing the lead frame with said series of treatment processes from plating treatment to resin molding, said resin molding having said adhesive tape or resin film embedded therein when said lead frame is subjected to a resin molding treatment.
Dependencies are inferred from the claim text.