Power supply structure for multichip package
AssigneeNEC Corporation
InventorShoji Umesato
Life of this patent
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Abstract
A power supply structure for a multichip package is provided to improve the transmission performance of signals. Cases are fitted onto one face of a ceramic substrate. On the other face are aligned substrates. On each of the substrates are erected I/O pins. The I/O pins are connected to signal pins of LSIs via the ceramic substrate's internal layer. On side faces of the substrates are provided power supply pads. To the power supply pads are connected the power supply pins of the LSIs via the ceramic substrate's internal layer. When power is to be supplied, electroconductive bars are inserted between the substrates. The electroconductive bars supply power to the LSIs via the power supply pads. A cable is connected to one of the I/O pins.
Claims6
A power supply structure for a multichip package comprising:
- a first substrate;
- integrated circuits mounted on a first face of this first substrate, said integrated circuits having signal pins and power supply pins;
- a plurality of second substrates aligned on a second face of said first substrate;
- power supply pads provided on side faces of said second substrates, said power supply pads being connected to said power supply pins of said integrated circuits via said first substrate;
- and
- a bar inserted between each couple of said second substrates, said bar being at least partly electroconductive, said bar being electrically connected to said power supply pads when inserted between said second substrates, and said bar being supplied with power.
Dependencies are inferred from the claim text.