US 5,475,567 AGranted

Method for hermetically sealing a single layer ceramic thick film electronic module

AssigneeDelco Electronics Corporation

InventorJohn A. Hearn

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Abstract

A method is provided for hermetically sealing a surface-mounted thick film electronic module within a cover soldered to a ceramic substrate, under the circumstances in which the input/output terminals of the electronic module are electrically interconnected with their corresponding external conductors on the exterior of the cover with a number of conductors. The integrity of the hermetic seal is promoted by routing the conductors beneath the ceramic substrate, as opposed to printing the conductors directly on the surface of the ceramic substrate, which necessitates that a dielectric material be placed intermediate the conductors and the bond material so as to electrically isolate the conductors from the bond material and cover. Consequently, an advantage of the present invention is the avoidance of a material mismatch between the dielectric material and the bonding material and the cover.

Claims8

Dependent claims

A single layer ceramic substrate having an electronic module mounted to a first outer surface of said ceramic substrate, said ceramic substrate comprising:

a cover secured to said first outer surface of said ceramic substrate so as to form a hermetic seal with said ceramic substrate and enclose said electronic module on said ceramic substrate;
a first hole formed through said ceramic substrate within an area of said ceramic substrate enclosed by said cover;
a second hole formed through said ceramic substrate outside of said area enclosed by said cover:
an external conductor disposed on said first outer surface of said ceramic substrate outside of said area enclosed by said cover;
an electrical conductor for electrically interconnecting said electronic module to said external conductor, said electrical conductor having a first end electrically connected to said electronic module, a second end electrically connected to said external conductor, an intermediate portion projecting through said first hole from said first outer surface of said ceramic substrate to a second outer surface of said ceramic substrate, extending along said second outer surface to said second hole, and projecting through said second hole to electrically interconnect said first and second ends;
and
a dielectric tape bonded to said second outer surface of said ceramic substrate so as to hermetically seal said first hole.

4 more elements

Dependencies are inferred from the claim text.