Functional substrates for packaging semiconductor chips

A multi-chip module comprising:

• an interconnection substrate;
• and
• a plurality of integrated circuit elements, each integrated circuit element being coupled to the interconnection substrate, wherein each integrated circuit element includes:
• a semiconductor chip;
• and
• at least one functional substrate, wherein each functional substrate comprises a single type of passive electrical functional elements wherein each functional substrate in each integrated circuit, element includes different types of passive electrical functional elements, wherein at least one functional substrate is coupled to the interconnection substrate, wherein the semiconductor chip is coupled to a functional substrate, and wherein the electrical functional elements of each functional substrate are in electrical contact with the semiconductor chip.

An inventory for assembling a multi-chip module for accommodating a plurality of integrated circuit elements, wherein the inventory comprises a plurality of each of the following:

• (a) a resistor substrate incorporating a plurality of thin film resistors formed on the substrate and a plurality of bonding pads on each face of the resistor substrate, the resistors being connected to at least a portion of the bonding pads;
• (b) a capacitor substrate incorporating a plurality of thin film capacitors formed on the substrate and a plurality of bonding pads on each face of the capacitor substrate, the capacitors being connected to at least a portion of the bonding pads;
• (c) an interconnection substrate comprising a plurality of bonding pads on at least one face of the interconnection substrate, and interconnections on the substrate making electrical connections between at least a portion of the bonding pads;
• and
• (d) integrated circuit chips adapted to be carried by one of the resistor or capacitor substrate, and having bonding pads connected to bonding pads of the carrying substrate, wherein the bonding pads on each face of each substrate and bonding pads on each integrated circuit chip are in an identical pattern for face-to-face interconnection.

A multi-chip module comprising:

• an interconnection substrate having a plurality of signal traces;
• a plurality of integrated circuit elements connected with the interconnection substrate, wherein each integrated circuit element comprises:
• a first functional substrate comprising a plurality of passive functional electrical elements of a single type and coupled to the interconnection substrate;
• at least one second functional substrate comprising a plurality of passive functional electrical elements of a single type, wherein the functional elements of each second functional substrate are different than the functional elements in both the first functional substrate and other second functional substrates, wherein at least one second functional substrate is coupled to first functional substrate;
• and
• a semiconductor chip of integrated circuits carried by a second functional substrate and in electrical contact with the functional electrical elements of the first functional substrate and each second functional substrate.