Semiconductor device and carrier for carrying semiconductor device

A semiconductor device comprising:

• a plurality of leads respectively made up of an inner lead and an outer lead;
• a semiconductor chip electrically connected to the inner leads;
• and
• a package encapsulating at least the inner leads and said semiconductor chip, wherein the outer leads extend outwardly from said package,
• said package having an upper part and a lower part which have different sized perimeters, said upper part and lower part formed together such that a flat stepped part is formed between the upper and lower parts due to the different sized perimeters,
• ones of said outer leads having a wide part which is wider than other parts of the outer lead extending outwardly from said package, said wide part being provided only on the stepped part of said package, wherein each outer lead has an exposed surface which is exposed at the stepped part, and surfaces of each outer lead other than the exposed surface are embedded in one of the upper and lower parts having a larger perimeter at the stepped part.

A semiconductor device comprising:

• a plurality of leads respectively made up of an inner lead and an outer lead;
• a semiconductor chip electrically connected to the inner leads;
• and
• a package encapsulating at least the inner leads and said semiconductor chip, wherein the outer leads extend outwardly from said package,
• said package having an upper part and a lower part which have different sized perimeters, said upper part and lower part formed together such that a flat stepped part is formed between the upper and lower parts due to the different sized perimeters,
• ones of said outer leads having a wide part which is wider than other parts of the outer lead extending outwardly from said package, said wide part being provided only on the stepped part of said package, wherein each outer lead has a length of at least 400 .mu.m along the stepped part.

An apparatus including a semiconductor device and a carrier for carrying the semiconductor device, said apparatus comprising:

• the semiconductor device comprising:
• a plurality of leads respectively made up of an inner lead and an outer lead,
• a semiconductor chip electrically connected to the inner leads, and
• a generally rectangular package encapsulating at least the inner leads and the semiconductor chip, wherein the outer leads extend outwardly from said package, said package having an upper part and a lower part which have different sized perimeters, said upper part and lower part formed together such that a flat stepped part is formed between the upper and lower parts due to the different sized perimeters, ones of said outer leads having a given width with a wide part having a width which is wider than the given width of other parts of the outer lead, said wide part being exposed only at the stepped part of said package;
• and
• the carrier comprising:
• a sidewall part having a hollow rectangular column shape and which opens at a top and a bottom thereof, and
• locking parts, provided on said sidewall part, locking respective corners of the stepped part of the semiconductor device which is accommodated within the sidewall part,
• said sidewall part surrounding sides of the semiconductor device, protecting the outer leads.