Resin composition

A resin composition comprising

• (A) 10-80 parts by weight of a polyphenylene ether resin,
• (B) 90-20 parts by weight of a polyamide resin, and
• (C) 3-70 parts by weight, per 100 parts by weight of the polyphenylene ether resin and polyamide resin combined, of a plate-like inorganic filler having an average particle size of no more than 5 .mu.m and an aspect ration of no less than 3, and
• wherein the temperature difference between (i) the crystallization initiation temperature of a composition comprising 90 wt. % of the polyamide resin and 10 wt % of the inorganic filler and (ii) the crystallization initiation temperature of the polyamide resin is 5.degree. C. or less;
• and wherein the polyphenylene ether resin and the polyamide resin are compatabilized.

A resin composition consisting essentially of

• (A) 10-80 parts by weight of a polyphenylene ether resin,
• (B) 90-20 parts by weight of a polyamide resin, and
• (C) 3-70 parts by weight, per 100 parts by weight of the polyphenylene ether resin and polyamide resin combined, of a plate-like inorganic filler having an average particle size of no more than 5 .mu.m and an aspect ration of no less than 3,
• wherein the temperature difference between (i) the crystallization initiation temperature of a composition comprising 90 wt. % of the polyamide resin and 10 wt % of the inorganic filler and (ii) the crystallization initiation temperature of the polyamide resin is 5.degree. C. or less.

A resin composition consisting essentially of

• (A) 10-80 parts by weight of a polyphenylene ether resin,
• (B) 90-20 parts by weight of a polyamide resin, and
• (C) 3-70 parts by weight, per 100 parts by weight of the polyphenylene ether resin and polyamide resin combined, of a plate-like inorganic filler having an average particle size of no more than 5 .mu.m and an aspect ration of no less than 3,
• wherein the temperature difference between (i) the crystallization initiation temperature of a composition comprising 90 wt. % of the polyamide resin and 10 wt % of the inorganic filler and (ii) the crystallization initiation temperature of the polyamide resin is 5.degree. C. or less;
• and wherein the polyphenylene ether resin and the polyamide resin are compatabilized.