Conductor-filled thermosetting resin
AssigneeThermoset Plastics, Inc.
InventorsWilliam L. Jamison, Andrzej Moscicki
Life of this patent
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Abstract
Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach adhesive. The thermosetting resins exhibit rheological properties that allow them to be substituted for state-of-the-art solder paste and die attach adhesives. The conductor filled resins can be thermally cured in in-line processing operations to provide a low stress, substrate adherent, electrically conductive resin matrix.
Claims17
A thermosetting resin formulation comprising
- about 15 to about 60 weight percent of a resin composition comprising about 30 to about 80 weight percent of a free radical cross-linkable unsaturated polyester or vinyl ester, about 5 to about 35 weight percent of a thermoplastic resin and about 0 to about 70 weight percent of an unsaturated monomer capable of cross-linking the cross-linkable polyester or vinyl ester,
- about 40 to about 85 weight percent of an electrically conductive microparticulate filler, and
- a free radical initiating agent in an amount effective to promote thermosetting of said formulation to a shape retaining electrically conducting resin matrix in about 30 seconds to about 5 minutes at about 100.degree. to about 200.degree. C.
Dependencies are inferred from the claim text.