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US 5,474,957 AGranted
Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps
AssigneeNEC Corporation
InventorMichitaka Urushima
Life of this patent
Estimating the term…
Abstract
Conductive leads are connected at inner ends thereof to electrodes of a semiconductor chip through a tape automated bonding process, and bumps are formed on the other ends of the conductive leads so as to economically and reliably mount the semiconductor chip on a circuit board through a concurrent reflow.
Claims14
A process of mounting a semiconductor chip on a conductive circuit pattern, comprising the steps of:
- a) preparing a tape automated bonding tape having a film carrier tape formed with sprocket holes, a device hole and separation holes around said device hole and a pattern formed from a metal film on one surface of said film carrier tape and containing inner leads and pads coplanar with said inner leads;
- b) connecting said inner leads to electrodes of a semiconductor chip;
- c) covering connections between said inner leads and said electrodes with a piece of resin for protecting said semiconductor chip and making said connection secure;
- d) forming bumps on said pads;
- cutting along said separation holes for a separation;
- e) aligning said bumps with pads formed on a mounting board;
- and
- f) connecting said bumps to said pads on said mounting board.
5 more elements
A process of mounting a semiconductor chip on a mounting board means, comprising the steps of:
- a) preparing a semiconductor chip, a mounting board means and a tape-automated bonding tape including a film carrier tape having a first area and a second area separable from said first area and a conductive pattern having inner leads and pads electrically connected to said inner leads formed in said second area;
- b) bonding said inner leads to electrodes of said semiconductor chip;
- c) forming conductive bumps on said pads;
- d) separating said second area having said conductive pattern electrically connected to said electrodes of said semiconductor chip from said first area;
- and
- e) bonding said conductive bumps to a conductive pattern on said mounting board means.
3 more elements
Dependencies are inferred from the claim text.