Superconducting circuit sub-assembly having an oxygen shielding barrier layer
AssigneeKYOCERA Corporation
InventorsShigeo Tanahashi, Takanori Kubo, Kazuhiro Kawabata
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Abstract
A circuit sub-assembly as a mounting for an electronic component such as Josephson device, i.e., a superconducting element, comprises a ceramic insulating substrate, an oxygen-shielding barrier layer formed on the insulating substrate, and a circuit film of niobium, as a superconducting material formed on the barrier layer according to a desired pattern. The barrier layer prevents oxidation of the circuit layer by shielding it from oxygen present in the insulating substrate. Due to the barrier layer, the circuit film is scarcely subject to superconductivity-impairing oxidation. The circuit film is thus capable of high-speed electronic signal conduction.
Claims14
A circuit sub-assembly as a mounting for a superconducting electronic component, comprising:
- an insulating substrate composed of ceramic material and comprising a sintered body selected from the group consisting of aluminum oxide and mullite,
- an oxygen-shielding barrier layer formed on the insulating substrate, and
- a superconducting circuit film of niobium formed on the barrier layer, wherein said barrier layer is formed of at least one element selected from the group consisting of titanium, molybdenum, wolfram, aluminum, tantalum, titanium-wolfram, tantalum nitride and an electrically insulating resin.
Dependencies are inferred from the claim text.