Electronic device sealing resin compositions and sealed electronic devices
AssigneeKureha Kagaku Kogyo Kabushiki Kaisha
InventorsToshitaka Kouyama, Keiichiro Suzuki, Toshio Enoki, Yasuo Sakaguchi
Life of this patent
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Abstract
Disclosed herein are electronic device sealing resin compositions containing (A) 40-25 parts by weight of a thermoplastic resin composed of 100-10 wt. % of a poly(arylene thioether-ketone) and 0-90 wt. % of a poly(arylene sulfide), (B) 60-75 parts by weight of an inorganic filler, and per 100 parts by weight of the sum of the thermoplastic resin (A) and inorganic filler (B), (C) 1.5-5 parts by weight of a silicone oil, (D) 10-15 parts by weight of a silicone rubber or (C) 0.5-3 parts by weight of a silicone oil and (D) 5-13 parts by weight of a silicone rubber. Electronic devices sealed using such resin compositions are also disclosed.
Claims13
(A) A sealed electronic device, said electronic device being sealed with an electronic device sealing resin composition comprising:
- 4- 25parts by weight of a thermoplastic resin composed of (i) 100-10 wt. % of a poly(arylene thioether-ketone) having at least 50 wt. % of recurring units of the formula ##STR3## wherein the --CO-- and --S-- are in the para position to each other, and having the following physical properties (a)-(c):
- (a) a melting point, Tm, of 310.degree.-380.degree. C.;
- (b) a melt crystallization temperature, Tmc (420.degree. C./10 min), of at least 210.degree. C., and a residual melt crystallization enthalphy, .DELTA.Hmc (420.degree. C./10 min) of at least 10 J/g, wherein .DELTA.Hmc (420.degree. C./10 min) and Tmc (420.degree. C./10 min) are determined by a differential scanning calorimeter at a cooling rate of 10.degree. C./min after the poly(arylene thioether-ketone) is held at 50.degree. C. for 5 minutes in an inert gas atmosphere, heated to 420.degree. C. at a rate of 75.degree. C./min and then held for 10 minutes at 420.degree. C.;
- and
- (c) a reduced viscosity, .eta..sub.red being 0.2-2 dl/g as determined by viscosity measurement at 25.degree. C. and a polymer concentration of 0.5 g/dl in 98% by weight sulfuric acid;
- and (ii) 0-90 wt. % of a different poly(arylene sulfide) containing at least 50 wt. % of recurring units of the formula;
- ##STR4## (B) 60-75 parts by weight of silica;
- and (C) 1.5-5 parts by weight, per 100 parts by weight of the thermoplastic resin (A) and the silica (B) combined, of a silicone oil having a viscosity of 10-10,000 centistokes at 25.degree. C.
A sealed electronic device, said electronic device being sealed with an electronic device sealing resin composition comprising:
- (A) 40-25 parts by weight of a thermoplastic resin composed of (i) 100-10 wt. % of a poly(arylene thioether-ketone) having at least 50 wt. % of recurring units of the formula ##STR5## wherein the --CO-- and --S-- are in the para position to each other, and having the following physical properties (a)-(c):
- (a) a melting point, Tm, of 310.degree.-380.degree. C.;
- (b) a melt crystallization temperature, Tmc (420.degree. C./10 min), of at least 210.degree. C., and a residual melt crystallization enthalphy, .DELTA.Hmc (420.degree. C./10 min) of at least 10 J/g, wherein .DELTA.Hmc (420.degree. C./10 min) and Tmc (420.degree. C./10 min) are determined by a differential scanning calorimeter at a cooling rate of 10.degree. C./min after the poly(arylene thioether-ketone) is held at 50.degree. C. for 5 minutes in an inert gas atmosphere, heated to 420.degree. C. at a rate of 75.degree. C./min and then held for 10 minutes at 420.degree. C.;
- and
- (c) a reduced viscosity, .eta..sub.red being 0.2-2 dl/g as determined by viscosity measurement at 25.degree. C. and a polymer concentration of 0.5 g/dl in 98% by weight sulfuric acid;
- and (ii) 0-90 wt. % of a different poly(arylene sulfide) containing at least 50 wt. % of recurring units of the formula ##STR6## (B) 60-75 parts by weight of silica;
- and (C) 10-15 parts by weight, per 100 parts by weight of the thermoplastic resin (A) and the silica (B) combined, of a silicone rubber.
A sealed electronic device, said electronic device being sealed with an electronic device sealing resin composition comprising:
- (A) 40-25 parts by weight of a thermoplastic resin composed of (i) 100-10 wt. % of a poly(arylene thioether-ketone) having at least 50 wt. % of recurring units of the formula ##STR7## wherein the --CO-- and --S-- are in the para position to each other, and having the following physical properties (a)-(c):
- (a) a melting point, Tm, of 310.degree.-380.degree. C.;
- (b) a melt crystallization temperature, Tmc (420.degree. C./10 min), of at least 210.degree. C. and a residual melt crystallization enthalphy, .DELTA.Hmc (420.degree. C./10 min) of at least 10 J/g, wherein .DELTA.Hmc (420.degree. C./10 min) and Tmc (420.degree. C./10 min) are determined by a differential scanning calorimeter at a cooling rate of 10.degree. C./min after the poly(arylene thioether-ketone) is held at 50.degree. C. for 5 minutes in an inert gas atmosphere, heated to 420.degree. C. at a rate of 75.degree. C./min and then held for 10 minutes at 420.degree. C.;
- and
- (c) a reduced viscosity, .eta..sub.red being 0.2-2 dl/g as determined by viscosity measurement at 25.degree. C. and a polymer concentration of 0.5 g/dl in 98% by weight sulfuric acid;
- and (ii) 0-90 wt. % of a poly(arylene sulfide) containing at least 50 wt. % of recurring units of the formula ##STR8## (B) 60-75 parts by weight of silica;
- and (C) 0.5-3 parts by weight of a silicone oil having a viscosity of 10-10,000 centistokes at 25.degree. C. and 5-13 parts by weight of a silicone rubber, both, per 100 parts by weight of the thermoplastic resin (A) and the silica (B) combined.
A sealed electronic device, said electronic device being sealed with an electronic device sealing resin composition comprising:
- (A) 40-25 parts by weight of a thermoplastic resin composed of 100-10wt. % of a poly(arylene thioether-ketone) and 0-90 wt. % of a poly(arylene sulfide);
- (B) 60-75 parts by weight of silica;
- and
- (C) 1.5-5 parts by weight, per 100 parts by weight of the sum of the thermoplastic resin (A) and the silica (B), of a silicone oil.
Dependencies are inferred from the claim text.