Method of treating an electrodeposited photosensitive resist to reduce water spotting
AssigneeNippon Paint Co., Ltd.
InventorsMamoru Seio, Kazuyuki Suga, Kanji Nishijima
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Abstract
Water spotting which occurs during rinsing of an electrodeposited photosensitive resist composition on a copper layer of a printed circuit board is reduced by applying an aqueous solution containing a surfactant. The surfactant is preferably a salt of an acylated polypeptide which is solid at ambient room temperature and forms a thin uniform film when the solution is dried.
Claims2
A process for surface treating an electrodeposited photosensitive resin film to reduce water spotting, comprising electrodepositing a photosensitive resin composition on a copper plate for a printed circuit board to form a resist layer, applying an aqueous solution containing an organic or inorganic alkali salt of an acylated polypeptide as a surfactant in an amount of 0.005 to 50 wt % on the electrodeposited film, and then drying, said acylated polypeptide being solid at ambient room temperature.
Dependencies are inferred from the claim text.