Loading patent…
AssigneeFujitsu Limited
InventorsHabib Vafi, Solomon I. Beilin, Wen-chou V. Wang
Estimating the term…
Interconnect carriers for coupling integrated circuit chips to major substrates and methods for making the same are disclosed. The interconnect carrier comprises a relatively thin resilient supporting layer, a plurality of electrically conductive vias formed through the surfaces of the supporting layer, and an outer frame disposed around the periphery of the supporting layer. The supporting layer preferably comprises an electrically insulating material. The flexibility of the supporting layer enables the layer to more readily conform to the warpages of the IC chip and supporting substrate, while the outer frame provides mechanical support and prevents the supporting layer from folding, twisting, and/or stretching. The thickness of the supporting layer may be substantially reduced over that of prior art interposers to enable methods for constructing smaller diameter vias.
A method for constructing an interconnect carrier having a surface capable of being connected to an integrated circuit chip, said method comprising the steps of:
An interconnect carrier having a surface capable of being connected to an integrated circuit chip, comprising:
An interconnect carrier having a surface capable of being connected to an integrated circuit chip, comprising:
Dependencies are inferred from the claim text.