External lead bonding method and apparatus
AssigneeKabushiki Kaisha Shinkawa
InventorKoji Sato
Life of this patent
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Abstract
A bonding method and apparatus for bonding leads of a solid-state device to leads of a lead frame includes a tool arm formed with first and second bonding sections. The first bonding section bonds external leads on two opposing sides of the solid-state device to leads of the lead frame, and then the second bonding section bonds external leads on other two opposing sides of the solid-state. When these bindings are performed, the solid-state device except for the external leads is not in touch with the bonding sections that are defined by pairs of ridges.
Claims6
An external lead bonding method using a tool arm which comprises a first bonding tool section which bonds external leads installed along two opposite sides of a solid-state device to the leads of a lead frame and a second bonding tool section which bonds external leads installed along the other two opposite sides of said solid-state device to said leads of said lead frame, wherein said method comprising the steps of:
- bonding said outer leads of said solid-state device to said leads of said lead frame by said first bonding tool section with said solid-state device attached via vacuum suction to a vacuum suction chucking head and pressed against the lead frame;
- stopping said vacuum suction chucking of said solid-state device via said vacuum suction chucking head;
- withdrawing vacuum suction chucking head from said bonding station;
- and
- bonding remaining two opposite sides of said solid-state device by said second bonding tool section.
An external lead bonding apparatus comprising:
- a vacuum suction chucking head for pressing a suction-chucked solid-state device against a lead frame which is positioned in a bonding station;
- and
- a bonding apparatus which bonds external leads of a solid-state device to leads of a lead frame, said tool arm being provided with:
- a first bonding tool section which has an escape space formed therein so that said escape space being kept from interfering with a vacuum suction chucking head, said first bonding tool simultaneously bonding said external leads installed along two opposite sides of said solid-state device, while said device is pressed against said lead frame by vacuum suction chucking head, to leads of said lead frame, and
- a second bonding tool section which simultaneously bonds external leads installed along other two opposite sides of said solid-state device to leads of said lead frame.
A bonding apparatus for bonding external leads of a square solid-state device to leads of a lead frame comprising a bonding tool which is provided with two bonding sections so that leads of two opposing sides of said square solid-state device are bonded by one of said two bonding sections and leads of other two opposing sides of said square solid-state device are bonded by another one of said two bonding sections.
Dependencies are inferred from the claim text.