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US 5,474,224 AGranted
Wire bonder and wire bonding method
AssigneeKaijo Corporation
InventorsKimiji Nishimaki, Takashi Kamiharako
Life of this patent
Estimating the term…
Abstract
The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder. A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a bonded indentation is present within a specified range at a location specified in advance and/or centering on said location.
Claims39
A wire bonder for bonding a wire to an electronic means, comprising:
- a table for supporting said electronic means;
- a recognition device including a camera and memory;
- a control device for performing various controls based on the evaluation from said recognition device;
- and
- a drive device that drives at least one of said camera and said table relative to each other based on commands from said control device, wherein a first or second bonding point in the form of bonded sites on said electronic means is photographed by said camera based on commands from said control device, and inspection is performed by said control device as to whether a bonded indentation is present within a specified range at a location specified in advance on said electronic means.
2 more elements
A wire bonding method comprising the following steps:
- photographing a first or second bonding point in the form of bonded sites;
- and
- determining whether a bonded indentation is present within a specified range at a location specified in advance and/or centered on said location.
A wire bonder for bonding a wire to an electronic means, comprising:
- a table for supporting said electronic means;
- a recognition device including a camera and memory;
- a control device that performs various controls based on the evaluation from said recognition device;
- and
- a drive device that drives at least one of said camera and said table relative to each other based on commands from said control device, wherein a first or second bonding point in the form of bonded sites on said electronic means is photographed by said camera based on commands from said control device, inspection is performed as to whether a bonded indentation is present within a specified range at a location specified in advance on said electronic means, and stitch location is detected from a specified location by said control device when an indentation is evaluated as being present.
2 more elements
A wire bonding method comprising the following steps:
- photographing a first or second bonding point in the form of bonded sites;
- determining whether a bonded indentation is present within a specified range at a location specified in advance;
- and
- detecting stitch location from a specified location when an indentation is evaluated as being present.
1 more element
A wire bonder for bonding a wire to an electronic means, comprising:
- a table for supporting said electronic means;
- a recognition device including a camera and memory;
- a control device that performs various controls based on the evaluation from said recognition device;
- and
- a drive device that drives said camera and said table relative to each other based on commands from said control device, wherein a first or second bonding point in the form of bonded sites on said electronic means is photographed by said camera based on commands from said control device, inspection is performed as to whether a bonded indentation is present within a specified range at a location specified in advance, the amount of deviation to the location of an indentation from a specified location is detected by said control device when an indentation is evaluated as being present, said data is accumulated and statistical processing is performed when said amount of deviation is within a predetermined deviation range, and one of camera tool distance and individual bonding reference coordinates are corrected and updated so that said indentation location agrees with a location specified in advance on said electronic means.
2 more elements
A wire bonding method comprising the following steps:
- photographing a first or second bonding point in the form of bonded sites;
- determining whether a bonded indentation is present within a specified range at a location specified in advance on said location;
- detecting the amount of deviation to the location of an indentation from a specified location when an indentation is evaluated as being present;
- accumulating and processing said data when said amount of deviation is within a predetermined deviation range;
- and
- correcting one of camera tool distance and individual bonding reference coordinates so that said indentation location agrees with a location specified in advance.
3 more elements
A wire bonder for bonding a wire to an electronic means, comprising:
- a table for supporting said electronic means;
- a recognition device including a camera;
- a control device that performs various controls based on the evaluation from said recognition device;
- and
- a drive device that drives at least one of said camera and said table relative to each other based on commands from said control device, wherein a first or second bonding point in the form of bonded sites on said electronic means is photographed by said camera based on commands from said control device, inspection is performed as to whether a bonded wire is present within a specified range at a location specified in advance on said electronic means, and detection of misattachment of said bonded wire is performed.
2 more elements
A wire bonder for bonding a wire to an electronic means, comprising:
- a table for supporting said electronic means;
- a recognition device including a camera and memory;
- a control device that performs various controls based on the evaluation from said recognition device;
- and
- a drive device that drives at least one of said camera and said table relative to each other based on commands from said control device, wherein a first or second bonding point in the form of bonded sites on said electronic means is photographed by said camera based on commands from said control device, inspection is performed as to whether a bonded wire is present within a specified range at a location specified in advance on said electronic means, detection of misattachment of said bonded wire is performed, and notification is performed by said control device and said apparatus is stopped in case a bonded wire is evaluated as not being present at a predetermined location.
2 more elements
A wire bonding method comprising the following steps:
- photographing a first or second bonding point in the form of bonded sites;
- determining whether a bonded wire is present within a specified range at a location specified in advance on said location;
- and
- detecting whether misattachment of said bonded wire has occurred.
1 more element
A wire bonding method comprising the following steps:
- photographing a first or second bonding point in the form of bonded sites;
- determining whether a bonded wire is present within a specified range of a location specified in advance;
- and
- determining the amount of wire curvature by determining the distance from a location specified in advance between said first bonding point and said second bonding point to the wire when the wire is evaluated as being present according to said inspection.
1 more element
Dependencies are inferred from the claim text.