Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards

A method of forming a multi-layer circuit board or card, said method comprising the steps of:

• a) forming a plurality of conductive planes, said conductive planes including ground, signal, or power planes;
• b) forming at least one through hole through at least one of said conductive planes;
• c) depositing an electrically conductive material onto an inside surface of said at least one through hole to form a plated through hole;
• d) forming at least one thermal relief passage at least through said at least one of said conductive planes, said at least one thermal relief passage being located in the vicinity of said at least one through hole and being free from electrical connection therewith, said at least one thermal relief passage being a thermal vent, said thermal vent being a hollow opening, wherein said at least one thermal relief passage is formed with eight sides, a first side being formed parallel to a straight line passing through a center of said at least one through hole;
• a second side being formed parallel to said first side, said first side being formed closer to said at least one through hole;
• third and forth sides being formed connected to opposite ends of said first side, said third and fourth sides extending from opposite ends of said first side at an acute angle toward said at least one through hole;
• fourth and fifth sides formed extending from opposite ends of said second side parallel to said third and fourth sides respectively;
• seventh and eighth sides formed connecting said third and fourth sides with said fifth and sixth sides and being angled toward a center of said thermal vent with increasing distance from said at least one through hole;
• e) depositing an electrically insulating material on at least one side of each of said conductive planes;
• f) placing said conductive planes on top of each other such that a layer of electrically insulating material is located between each of said conductive planes;
• and
• g) joining said conductive planes together to form said multi-layer circuit board or card wherein said at least one thermal relief passage is a thermal vent formed in at least one of said conductive planes, said thermal vent being a hollow opening formed in said at least one conductive plane and being formed in the vicinity of said at least one plated through hole.

A method of forming an electronic package, comprising the steps of:

• a) forming a plurality of conductive planes, said conductive planes including ground, signal, or power planes;
• b) forming a plurality of through holes through a plurality of said conductive planes;
• c) depositing an electrically conductive material onto an inside surface of said through holes to form plated through holes;
• d) forming at least one thermal relief passage in at least one of said conductive planes, said at least one thermal relief passage located in the vicinity of at least one of said through holes and being free from electrical connection therewith;
• e) depositing an electrically insulating material on at least one side of each of said conductive planes;
• f) placing said conductive planes on top of each other such that a layer of electrically insulating material is located between each of said conductive planes;
• g) joining said conductive planes together to form a multi-layer circuit board or card;
• h) placing a pin attached to a chip or component into said at least one through hole;
• i) causing said electrically conductive material deposited onto an inside surface of said at least one through hole to be heated to a temperature at which it flows and secures said pin in said through hole upon cooling;
• j) cooling said plating material;
• and
• k) selectively forming a plurality of thermal vents in conductive planes of said multi-layer circuit board or card acting as ground planes, said thermal vents being in the vicinity of at least one of said through holes, said thermal vents being formed such that a first ground plane closest to a chip or component attached to said multi-layer circuit board or card does not include thermal vents in the vicinity of said at least one through hole, and ground planes further from said attached chip or component include thermal vents in the vicinity of said at least one through hole.

A method of forming an electronic package, comprising the steps of:

• a) forming a plurality of conductive planes, said conductive planes including ground, signal, or power planes;
• b) forming at least one through hole through at least one of said conductive planes;
• c) depositing an electrically conductive material onto an inside surface of said at least one through hole to form a plated through hole;
• d) selectively functionally connecting said conductive planes to said at least one through hole;
• e) forming a plurality of thermal relief passages through all of said conductive planes in the vicinity of a perimeter of said conductive planes, said thermal relief passages located in the vicinity of said at least one through hole and being free from electrical connection therewith;
• f) depositing an electrically insulating material on at least one side of each of said conductive planes;
• g) placing said conductive planes on top of each other such that a layer of electrically insulating material is located between each of said conductive planes;
• h) joining said conductive layers together to form a multi-layer circuit board or card;
• i) depositing an electrically conductive material on an inside surface of said thermal relief passages;
• j) electrically connecting each of said thermal relief passages either to all of said ground planes or all of said power planes;
• k) placing a pin attached to a chip or component into said at least one through hole;
• l) causing said electrically conductive material deposited onto an inside surface of said at least one through hole to be heated to a temperature at which it flows and secures said pin in said through hole upon cooling;
• m) cooling said plating material;
• and
• n) attaching a module to said multi-layer circuit board or card.