Photosensitive array wherein chips are not thermally matched to the substrate
AssigneeXerox Corporation
InventorKraig A. Quinn
Life of this patent
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Abstract
Semiconductor chips, such as photosensor arrays in a full-width scanner, are mounted on a substrate to maintain reasonably consistent spacing among chips regardless of temperature conditions during use. After chips are tacked onto the substrate with uncured epoxy, the assembly is brought to a low temperature prior to the heating of the curing step. The technique permits design of the assembly to compensate for differences between the thermal coefficient of expansion of the chips and that of the substrate, while also minimizing mechanical stresses on the chips caused by heating in the course of use.
Claims19
An assembly comprising:
- a substrate;
- and
- a plurality of semiconductor chips attached to the substrate, each of the semiconductor chips being in contact with one another at a first temperature and being spaced from one another at an operating temperature, with the first temperature being lower than the operating temperature.
An assembly comprising:
- a substrate;
- and
- a plurality of semiconductor chips attached to the substrate and arranged in a linear array on the substrate, each of the semiconductor chips having a main surface attached to the substrate, and a side surface in contact with a neighboring chip in the linear array at a first temperature and spaced from the neighboring chip at an operating temperature, with the first temperature being lower than the operating temperature.
Dependencies are inferred from the claim text.