Thermal head and manufacturing method
AssigneeAlps Electric Co., Ltd.
InventorsTakashi Shirakawa, Toshifumi Nakatani
Life of this patent
Estimating the term…
Abstract
A thermal head having high heat resisting characteristics and heat response capable of being sufficiently adapted for finer printing and achieving high quality printing at a high speed, the substrate thereof being formed of silicon and the heat accumulation layer thereof being formed of silicon, at least one selected among from elements such as Ta, W, and Mo and oxygen.
Claims4
A thermal head comprising a heat accumulating layer formed on a substrate, and a heating resistor layer and an electrode layer connected to the heating resistor layer formed on the heat accumulating layer, wherein said heat accumulating layer is formed of a compound including silicon, at least one transition metal, and oxygen.
Dependencies are inferred from the claim text.