Semiconductor memory component comprising stacked memory modules
AssigneeMatra Marconi Space France
InventorJacques De Givry
Life of this patent
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Abstract
A memory component has a rectangular semiconductor substrate containing active memory circuits and output terminals on a major surface thereof. An insulating layer on the major surface receives a plurality of metal connection leads, connecting the output terminals to connection pads located on the major surface along only one of longer sides of the substrate. A plurality of additional pads are distributed between the connecting pads and are devoid of connection leads. A memory module comprising several stacked memory components is also described, which uses the additional pads as relays.
Claims9
Memory component having:
- a rectangular semiconductor substrate containing active memory circuits and having output terminals on a major surface thereof;
- an insulating layer on said major surface;
- a plurality of metal connection leads on said insulating layer, said metal connection leads connecting said output terminals to connection pads located on said major surface along only one of longer sides of said substrate;
- and a plurality of additional pads which are distributed between said connection pads and are devoid of connection leads, said substrate having such a width that said connection pads are beyond a zone of said substrate which contains active memory circuits.
Memory component having:
- a rectangular semiconductor substrate containing active memory circuits and carrying output terminals on a major surface thereof;
- an insulating layer on said major surface, metal connecting leads located on said insulating surface and all located above a zone of said substrate containing active memory circuits, said metal connection leads connecting said output terminals to a plurality of connection pads located on said major surface along only one of longer sides of the substrate.
Memory module comprising:
- an interconnection support;
- and
- a plurality of memory components, all having a same elongated shape, and all mutually stacked in a same angular position;
- each said memory component having:
- a rectangular semiconductor substrate containing active memory circuits and having output terminals on a major surface thereof;
- an insulating layer on said major surface;
- and a plurality of metal connection leads on said insulating layer, said metal connection leads connecting said output terminals to connection pads located on said major surface along only one of longer sides of said substrate;
- two successive said components being mutually offset by an amount sufficient for the connection pads of one said component to be located beyond the component located above it in the stack.
Memory module comprising:
- an interconnecting support;
- and a plurality of memory components, all having a same elongated shape and all mutually stacked in a same angular position;
- each said memory component having:
- a rectangular semiconductor substrate containing active memory circuits and having output.. terminals on a major surface;
- an insulating layer on said major surface,a plurality of metal connection leads on said insulating layer, said metal connection leads connecting said output terminals to connection pads located on said major surface along only one of longer sides of said substrate;
- and a plurality of additional pads which are distributed between said connection pads and are devoid of connection leads, said additional pads constituting relays for bonding serially mounted short lengths of electrically insulated wire which constitute
- two successive said components being mutually offset by an amount sufficient for the connection pads and additional pads of one of said component to be located beyond the component located thereabove in the stack.
Dependencies are inferred from the claim text.