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US 5,473,190 AGranted
Tab tape
AssigneeIntel Corporation
InventorsShuji Inoue, Yasuhiko Hiraki, Mutsumi Agawa
Life of this patent
Estimating the term…
Abstract
A TAB tape is constituted by a base material consisting of, e.g., a polyimide, in which leads composed of a copper foil are formed on the base material, and a power supply unit and a signal unit formed on a substrate, such as a printed circuit board, are connected to electrodes formed on a chip via the copper foil leads. Power supply leads for supplying power to the chip, ground leads for grounding, and signal leads for exchanging signals with the chip are formed by the copper foil on one surface of the base material. A common power supply lead to be connected to the power supply leads and a common ground lead to be connected to the ground leads are formed by the copper foil on the other surface of the base material.
Claims21
A TAB tape comprising:
- a base material on which leads composed of a copper foil are formed and a power supply unit and a signal unit formed on a substrate are connected to a plurality of electrodes formed on a chip via said copper foil leads,
- wherein a plurality of power supply leads for supplying power to said chip, a plurality of ground leads for grounding, and a plurality of signal leads for exchanging signals with said chip are formed by said copper foil on one surface of said base material, and wherein a first end of each of said plurality of power supply leads, said plurality of ground leads and said plurality of signal leads is positioned for direct connection to a distinct one of said plurality of electrodes and a common power supply lead is connected to a second end, opposite said first end, of a plurality of at least two of said plurality of power supply leads and a common ground lead is connected to a second end, opposite said first end, of at least two of said plurality of ground leads are formed by said copper foil on the other surface of said base material.
A semiconductor integrated circuit (IC) apparatus comprising:
- a semiconductor IC chip having a periphery containing a plurality of electrodes;
- a TAB tape comprising a base material, wherein a plurality of leads composed of a copper foil are formed on said base material and a first end of each of said plurality of leads is directly connected to a distinct one of the plurality of electrodes of said semiconductor IC chip, wherein a plurality of power supply leads for supplying power to said semiconductor IC chip, a plurality of ground leads for grounding, and a plurality of signal leads for exchanging signals between said chip and a location external to said semiconductor IC apparatus are formed by said copper foil on one surface of said base material, and a common power supply lead and a common ground lead are formed by said copper foil on the other surface of said base material outside the periphery of the chip,
- and further wherein said common power supply lead is coupled to at least two of said plurality of power supply leads through the base material for receiving and transferring power from a power source external to said semiconductor IC apparatus via said at least two of said plurality of power supply leads.
A semiconductor integrated circuit (IC) apparatus comprising:
- a semiconductor IC chip having a periphery with a plurality of electrodes;
- a TAB tape comprising a base material, wherein a plurality of leads composed of a copper foil are formed on said base material and a first end of each of said plurality of leads is directly connected to one of the plurality of electrodes of said semiconductor IC chip, wherein a plurality of power supply leads for supplying power to said semiconductor IC chip, a plurality of ground leads for grounding, and a plurality of signal leads for exchanging signals between said chip and a location external to said semiconductor IC apparatus are formed by said copper foil on one surface of said base material, and a common power supply lead and a common ground lead are formed by said copper foil on the other surface of said base material outside the periphery of the chip,
- and wherein said common power supply lead is coupled to second end of a first number of said plurality of power supply leads through the base material for receiving and transferring power from a power source external to said semiconductor IC apparatus via said first number of power supply leads, and further wherein a second end of a second number of said plurality of ground leads are coupled through the base material to the common ground lead.
A semiconductor integrated circuit (IC) apparatus comprising:
- a semiconductor IC chip having a periphery with a plurality of electrodes;
- a TAB tape comprising a base material, wherein a plurality of leads composed of a copper foil are formed on said base material and a first end of said plurality of leads is directly connected to one of the plurality of electrodes of said semiconductor IC chip, wherein a plurality of power supply leads for supplying power to said semiconductor IC chip, a plurality of ground leads for grounding, and a plurality of signal leads for exchanging signals between said chip and a location external to said semiconductor IC apparatus are formed by said copper foil on one surface of said base material outside the periphery of the chip, and a common lead is formed by said copper foil on the other surface of said base material, and wherein said common lead is coupled to a second end of at least two of said plurality of leads on said one surface of said base material and acts as a pathway to an outer lead for said at least two of said plurality of leads on said one surface of said base material.
Dependencies are inferred from the claim text.