Semiconductor device of the LOC structure type having a flexible wiring pattern
AssigneeKabushiki Kaisha Toshiba
InventorTomoyuki Ando
Life of this patent
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Abstract
In a semiconductor device of the LOC (lead on chip) structure type according to the present invention, one ends of external connector leads are fixed to an insulating tape and the other ends thereof extend outside the insulating tape. Inner leads for internal wiring are arranged and fixed on the insulating tape, independently of the others. The insulating tape integral to both of these leads is fixed to the main surface of a semiconductor chip and the leads are connected to their corresponding electrode pads on the semiconductor chip via bonding wires. The insulating tape is bonded to a lead frame before the punching process and it thus made integral to the leads is then punched by the punching process. It therefore needs no bonding margin for the leads.
Claims18
A semiconductor device provided with a semiconductor chip having a main surface, comprising:
- an insulating member having first and second surfaces;
- a plurality of external connector leads, each having one end arranged flush with one side edge of the insulating member and fixed to the first surface of the insulating member and another end extended outside of said insulating member;
- at least one internal connector inner lead having a bottom surface fixed to the first surface of said insulating member;
- and
- assembly means in which at least the second surface of said insulating member is fixed to the main surface of the semiconductor chip,
- wherein both ends of said at least one inner lead are arranged flush with at least one side edge of said insulating member.
A semiconductor device provided with a semiconductor chip having a main surface, comprising:
- an insulating member having first and second surfaces;
- a plurality of external connector leads, each having one end arranged flush with one side edge of said insulating member and fixed to the first surface of the insulating member and another end extended outside of said insulating member, and protrusions of the insulating member being present at bottom surfaces of said external connector leads extending toward said another ends of said external connector leads;
- a plurality of internal connector inner leads, each having at least one end arranged flush with the one side edge of said insulating member and a bottom surface fixed to the first surface of the insulating member;
- and
- assembly means in which at least the second surface of said insulating member is fixed to the main surface of the semiconductor chip.
A semiconductor device provided with plural semiconductor chips, each having a main surface, the semiconductor device comprising:
- an insulating member having first and second surfaces;
- a plurality of external connector leads, each having one end arranged flush with one side edge of the insulating member and fixed to the first surface of the insulating member and another end extended outside of said insulating member;
- a plurality of internal connector inner leads, each having one end arranged flush with one side edge of the insulating member and having a bottom surface fixed to the first surface of the insulating members, at least one of the internal connector inner leads having both ends arranged flush with one side edge of the insulating member;
- and
- assembly means in which at least the second surface of said insulating member is fixed to the main surface of each of the semiconductor chips.
A semiconductor device provided with a semiconductor chip having a main surface, comprising:
- an insulating member having first and second surfaces;
- a plurality of external connector leads, each having one end arranged flush with one side edge of said insulating member and fixed to the first surface of the insulating member and another end extending outside of said insulating member;
- and
- assembly means in which at least the second surface of said insulating member is fixed to the main surface of the semiconductor chip,
- wherein the insulating member further includes protrusions present at bottom surfaces of said external connector leads extending toward said another ends of the external connector leads.
Dependencies are inferred from the claim text.