Method of bonding copper and a substrate for power electronics and made of a non-oxide ceramic
AssigneeSociete Anonyme dite Alcatel Alsthom Compagnie Generale d'Electricite
InventorsRoland Queriaud, Alain Petitbon
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Abstract
A method of bonding copper to a heat conducting and electrically insulating power electronics substrate made of a non-oxide ceramic selected from AlN, SiC, and BN, the method including the steps of oxidizing the surface of the substrate and then directly bonding copper to the oxidized surface of the substrate, wherein the step of oxidizing the surface of the substrate is performed by irradiating the surface using a laser beam to a thickness in the range 0.1 .mu.m to 3 .mu.m.
Claims6
A method of bonding copper to a heat conducting and electrically insulating power electronics substrate made of a non-oxide ceramic selected from AlN, SiC, and BN, the method comprising steps of oxidizing the surface of said substrate and then directly bonding copper to the oxidized surface of said substrate, wherein the step of oxidizing the surface of said substrate is performed by irradiating the surface using a laser beam to a thickness in the range 0.1 .mu.m to 3 .mu.m.
Dependencies are inferred from the claim text.