Method for making triniobium tin semiconductor
AssigneeGeneral Electric Company
InventorsMark G. Benz, Neil A. Johnson, Melissa L. Murray, Robert J. Zabala, Louis E. Hibbs, Jr., Bruce A. Knudsen
Life of this patent
Estimating the term…
Abstract
A method for making triniobium tin foil is disclosed where the niobium-based foil with an oxide layer is passed continuously at a set speed into an enclosed chamber. The enclosed chamber has an inert atmosphere which is substantially oxygen free. Upon entering the chamber, the foil passes through a decomposition anneal furnace, a low temperature tin dip, and then a high temperature reaction anneal furnace before exiting the chamber as triniobium tin foil.
Claims10
A method for forming triniobium tin superconductor where said method is performed in an enclosed chamber consisting essentially of an inert atmosphere that is substantially oxygen free, and comprises the step of:
- passing continuously at a uniform speed, a niobium-based foil having a thickness greater than about 0.0005 inches, with an oxide layer on said foil, through a vertical decomposition anneal furnace, starting at the top of the decomposition anneal furnace and traveling downward, at a temperature of above about 930.degree. C. for about 10-30 seconds, then through a molten tin bath at a temperature between about 300.degree.-800.degree. C. for a time and at a speed sufficient to achieve a desired thickness of a tin coating on the foil, and then through a vertical reaction anneal furnace, starting from the bottom of the reaction anneal furnace and traveling upward, at a temperature greater than 1100.degree. C., thereby forming a triniobium tin superconductor foil.
A method for forming a triniobium tin superconductor foil in an enclosed chamber consisting essentially of argon and up to twenty parts per million oxygen in the atmosphere, said method comprising;
- passing continuously at a constant speed, a niobium-one atomic percent zirconium-two atomic percent oxygen foil that is about 0.001 inch thick, through a vertical decomposition anneal furnace, starting at the top of the decomposition anneal furnace and exiting at the bottom of the decomposition anneal furnace, at a temperature above about 930.degree. C. for about 10-30 seconds, then through a molten tin bath consisting essentially of tin and seventeen atomic percent copper, at a temperature between about 700.degree.-800.degree. C. for a time and at a speed sufficient to achieve between about 2-30 micrometers of a tin coating on each side of the foil, and then through a vertical reaction anneal furnace, starting from the bottom of the reaction anneal furnace and exiting at the top of the reaction anneal furnace, at a temperature greater than 1100.degree. C., thereby the triniobium tin superconductor foil.
Dependencies are inferred from the claim text.