Structure of and method for manufacturing an LED
AssigneeAT&T Corp.
InventorsMindaugas F. Dautartas, Jose A. Lourenco
Life of this patent
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Abstract
An LED has both its p and n bonding pads on the p side of the wafer for simultaneous solder bump alignment and electrical connection of the LED with a device carrier. A groove is formed dividing the p material of the device into an active region and an inactive region. The groove also provides a path for the device's n-contact, which extends from the n-material at the base of the groove, up the side of the groove, to the n bonding pad on the surface of the inactive p material.
Claims14
A method for fabricating an LED from a double heterostructure wafer having a p-surface, an n-surface, an n-layer and a primary crystallographic plane, comprising:
- etching a groove in the p-surface parallel to the crystallographic plane, said groove exposing the n-layer of the wafer;
- forming a metal n-contact, said n-contact contacting said exposed n-layer and forming a continuous film up a wall of said groove and onto the p-surface;
- forming a metal p-contact on the p-surface opposite said groove from said n-contact;
- depositing a dielectric film on the p-surface, on said p- and n-contacts, and in said groove;
- defining openings in said dielectric film partially exposing said p-contact and said n-contact;
- depositing a metal film over said dielectric film and said openings;
- defining bonding pads sites on said dielectric film over said p- and n-contacts;
- forming bonding pads on said bonding pads sites;
- removing said metal film around said bonding pads to expose said dielectric film.
A method of manufacturing an LED, comprising:
- etching a groove on a p-surface of a semiconductor wafer to expose an n-layer;
- forming an n-contact extending from said n-layer to said p-surface;
- forming a p-contact on said p-surface;
- depositing a dielectric layer over said p-surface and said groove;
- forming two bonding pads on said p-surface, one each in electrical contact with said n-contact and said p-contact.
Dependencies are inferred from the claim text.