Pattern exposing method using phase shift and mask used therefor
AssigneeFujitsu Limited
InventorsKenji Nakagawa, Masao Kanazawa, Tamae Haruki, Yasuko Tabata
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AssigneeFujitsu Limited
InventorsKenji Nakagawa, Masao Kanazawa, Tamae Haruki, Yasuko Tabata
Estimating the term…
A pattern exposing method forms a predetermined resist pattern on a substrate by exposing a first resist layer which is formed on the substrate using a first reticle which includes a first pattern for exposing a first corresponding pattern on the first resist layer by use of a phase shift of light transmitted through the first reticle, developing the exposed first resist layer, exposing a second resist layer which is formed on the entire surface of the substrate, including a top of the first resist layer, using a second reticle which has a second pattern for exposing a second corresponding pattern on the second resist layer by use of light transmitted through the second reticle, where the second corresponding pattern overlaps at least a part of the first corresponding pattern, and developing the second resist layer so that a part of the first corresponding pattern is removed by the second corresponding pattern and the predetermined resist pattern is formed.
A pattern exposing method for forming a predetermined resist pattern on a substrate, said pattern exposing method comprising the steps of:
A mask for use in exposing a predetermined pattern on a resist layer which is formed on a substrate using a shift in phase of light transmitted through the mask, said mask comprising:
Dependencies are inferred from the claim text.