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US 5,472,546 AGranted
Method for making printed circuit boards
OwnerHartmuth F. Thalerinventor
Life of this patent
Estimating the term…
Abstract
To make a printed circuit board, bores bridge gaps between where conductor paths are to be located, and are then filled with an adhesive. The gaps between where the conductor paths are to be located then caustically removed so that a conductor path skeleton results which is held together by the adhesive bridges. Finally, the conductor path skeleton is affixed to an insulating layer.
Claims15
A method for making printed circuit boards comprised of a conductor pattern formed from a metal foil or sheet metal comprising the steps of:
- (a) inserting openings at predetermined locations in the metal foil or sheet metal in areas to be subsequently removed between conductor paths of the conductor pattern,
- (b) filling the openings with adhesive,
- (c) forming the conductor pattern by removing the metal foil or sheet in said areas while leaving connecting bridges comprised of said adhesive to mechanically stabilize the conductor pattern, and
- (d) affixing the formed conductor pattern mechanically stabilized by the connecting bridges to an insulating base.
1 more element
Dependencies are inferred from the claim text.