Polishing method and polishing device using the same
AssigneeSumitomo Metal Mining Co., Ltd.
InventorAtsushi Yamada
Life of this patent
Estimating the term…
Abstract
A polishing method and apparatus for a silicon substrate or the like, the method including disposing a polishing cloth in contact with a surface of a work to be polished, pressing the polishing cloth using pressing rods against the surface of the work to be polished in a region with a smaller area than the area of the surface of the work to be polished while adjusting the pressure of contact, and polishing the entire surface to be polished while moving the work relative to the polishing cloth and putting it under circulating movement with a radius smaller than a diametrical length of the region along the surface to be polished without autorotation.
Claims16
A polishing method which comprises disposing a polishing cloth in contact with a surface of a work to be polished, adjustably pressing the polishing cloth by a pressing rod against the surface of the work to be polished in a circular region defining a diametrical length and a smaller area than an area of the surface of the work to be polished, and polishing an entire surface to be polished by moving a polishing cloth and putting the work under circulating movement, the movement radius being smaller than said diametrical length pressed by each rod and without autorotation of the pressing rod.
A polishing method which comprises disposing a polishing cloth in contact with a surface of a work to be polished, adjustably pressing the polishing cloth by a pressing rod against the surface of the work to be polished in a region defining a diametrical length and a smaller area than an area of the surface of the work to be polished, and conducting polishing by moving a polishing region over the entire surface to be polished while moving the work relative to the polishing cloth and putting the work under circulating movement, the movement radius being smaller than said largest diametrical length pressed by each rod and without autorotation of the pressing rod, and revolving the polishing cloth along with the circulating motion of the work.
A polishing device comprising a work support device that supports a work and moves while conducting circulating motion along the surface of the work to be polished, a polishing cloth support device that supports the polishing cloth at the circumferential edge opposing to the surface of the work to be polished and in parallel with the surface to be polished and moves while causing the polishing cloth to be in contact with the work and a pressing rod support device that movably supports pressing rods disposed to the polishing cloth on the side opposite to the work toward the polishing cloth, in which each of the bottom ends of the pressing rods facing the polishing cloth is made spherical and an elastic member is disposed between the polishing cloth and the pressing rods.
A polishing device comprising a work support device that supports a work and moves while conducting circulating motion along the surface of the work to be polished, a polishing cloth support device that supports the polishing cloth at the circumferential edge opposing to the surface of the work to be polished and in parallel with the surface to be polished, causes the polishing cloth to move so as to be in contact with or apart from the work and rotatably holds the same and a pressing rod support device that movably supports pressing rods disposed to the polishing cloth on the side opposite to the work toward the polishing cloth, in which each of the bottom ends of the pressing rods facing the polishing cloth is made spherical and an elastic member is disposed between the polishing cloth and the pressing rods.
Dependencies are inferred from the claim text.