US 5,472,135 A · Reflow apparatus and method

Abstract

The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

Claims8

Dependent claims

A reflow apparatus for use in carrying out reflow soldering of a circuit board as the circuit board is moved in a transferring direction along a transfer path, said reflow apparatus comprising:

a nozzle comprising a row of bent plates mounted successively and in spaced apart relation along the transferring direction, each of said bent plates being elongated in a direction transverse to the transferring direction and having a downwardly opening U-shaped cross section;
wherein gas-flow slits, elongated in the direction transverse to the transferring direction, are defined between adjacent pairs of said bent plates;
and
wherein a hollow part is mounted at an end of said row of bent plates for receiving a portion of a gas flow emanating from said nozzle and for suddenly reducing a pressure of the portion of the gas flow so as to reduce a flowing speed thereof along a longitudinal direction of the transfer path.

1 more element

A reflow method for carrying out reflow soldering of a circuit board as the circuit board is moved in a transferring direction along a transfer path, said reflow method comprising:

providing a nozzle by mounting bent plates, having downwardly opening U-shaped cross sections, in spaced apart succession in a row along the transferring direction such that each of said bent plates is elongated in a direction transverse to the transferring direction, so as to define gas-flow slits, elongated in the direction transverse to the transferring direction, between adjacent pairs of said plates;
and
mounting a hollow part at an end of said row of bent plates for receiving a portion of a gas flow emanating from said nozzle and for suddenly reducing a pressure of the portion of the gas flow so as to reduce a flowing speed thereof along a longitudinal direction of the transfer path.

Dependencies are inferred from the claim text.

Reflow apparatus and method

Life of this patent

Reflow apparatus and method

Life of this patent

Abstract

Claims8