Environmental stress screening process with liquid coupled vibration
AssigneeAT&T IPM Corp.
InventorEdwin Z. Brown
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AssigneeAT&T IPM Corp.
InventorEdwin Z. Brown
Estimating the term…
A testing system for stressing assembled circuit boards well beyond normal operational limits with respect to mechanical vibration, supply voltage cycling, and temperature cycling. The combination of these three elements of stressing results in each of the three elements accelerating the effects of the other two elements. The circuit boards are transferred between a cold bath of inert liquid and a hot bath of inert liquid while power voltages are applied for short periods of time at voltages which exceed the normal voltages of the devices and vibrations are introduced into the inert liquid. The vibrations scan a broad range of frequencies thus accelerating the effect of the hot bath. In particular, in the hot bath, the use of ultrasonic frequency greatly accelerates the speed at which components are induced to absorb heat. The vibrations allow the detection of potential failures in the wire bonding of integrated circuits. The testing system allows for the integration of both vibration, supply voltage, and temperature stressing in one integrated work station allowing the goals of a just-in-time manufacturing process to be achieved.
An environmental stress testing system for stress testing circuit boards mounted in a carder, comprising:
A method for screening electronic circuit boards mounted in a carrier to detect potential infant failures, the method comprises the steps of:
Dependencies are inferred from the claim text.