Module having vertical peripheral edge connection
AssigneeInternational Business Machines Corporation
InventorsAlan P. Downie, Peter Gallagher, John J. Garrity, Brian L. Robertson
Life of this patent
Estimating the term…
Abstract
A direct chip attach module (DCAM) 10, comprises of one or more electronic components 30, electrically bonded to a printed circuit 40, on a substrate 20. The DCAM 10, is bonded to an electronic circuit assembly by connection pads 50, formed on the edge of the DCAM substrate 10. This enables easy visual inspection of solder joints between the DCAM and the assembly. DCAM substrates 10, are initially formed in a panel form 70, and vias 50, are drilled and filled with electrically conductive media 55, at predetermined connection points. The DCAM 10, is then excised from the parent panel 70, and the cut vias provide connection pads 55, along the edge of the substrate 10.
Claims13
An electronic circuit module comprising:
- a substrate carrying at least one printed circuit line,
- at least one electronic component secured to said substrate so as to be in electrical contact with said at least one printed circuit line, and
- wherein said substrate has at least one electrically conductive connection pad formed along at least one edge such that said at least one electrically conductive connection pad runs vertically from the top surface of said substrate to the bottom surface of said substrate.
An electronic circuit assembly comprising:
- a first substrate carrying at least one first printed circuit line,
- at least one first electronic component secured to said first substrate, such that said at least one first electronic component is in electrical contact with said at least one first printed circuit line,
- a second substrate carrying at least one second printed circuit line,
- at least one second electronic component secured to said second substrate, such that said at least one second electronic component is in electrical contact with said at least one second printed circuit line, and
- at least one electrically conductive connection pad along at least one edge of said second substrate to provide at least one electrical contact between said at least one first printed circuit line and said at least one second printed circuit line, and wherein said at least one electrically conductive connection pad runs vertically from the top surface of said second substrate to the bottom surface of said second substrate, and thereby forms said electronic circuit assembly.
Dependencies are inferred from the claim text.