Multi-chip module having an improved heat dissipation efficiency

A multi-chip module comprising:

• a substrate having upper and lower major surfaces;
• an interconnection pattern provided on said upper major surface of said substrate;
• a plurality of semiconductor chips provided commonly upon said upper major surface of said substrate in electrical connection with said interconnection pattern;
• a plurality of thermally conductive blocks each provided on corresponding one of said plurality of semiconductor chips in an intimate contact therewith;
• a resin package body that encapsulates therein said plurality of semiconductor chips and said plurality of thermally conductive blocks together with said substrate;
• said plurality of thermally conductive blocks having respective upper major surfaces at a level such that said upper major surfaces of said thermally conductive blocks form a substantially flush, planar surface with an upper major surface of said resin package body, said upper major surfaces of said thermally conductive blocks being thereby exposed at said upper major surface of said resin package body;
• a plurality of leads projecting from said resin package body, each of said plurality of leads being connected electrically to said interconnection pattern on said substrate;
• and
• a heat sink mounted upon said upper major surface of said resin package body such that said heat sink establishes an intimate contact with respective upper major surfaces of said thermally conducting blocks.