Interconnection between layers of striplines or microstrip through cavity backed slot
AssigneeHughes Missile Systems Company
InventorPyong K. Park
Life of this patent
Estimating the term…
Abstract
An interconnection between layers of stripline or microstripline in a multilayer microwave circuit assembly, through electromagnetic coupling. The adjacent layers (52 and 54) utilize a common ground plane layer (56), and a U-shaped coupling slot (64) is formed in the common ground plane. To eliminate undesirable coupling to other transmission line modes, the coupling slot is enclosed by a cavity (70) for each layer. The cavity size is selected so that no cavity mode exists, and to prevent formation of unwanted transmission modes. The "U" shape of the slot reduces the size of the cavity. The interconnection can be used with adjacent layers of stripline, microstrip line, or stripline and microstrip line.
Claims28
In a multilayer microwave integrated circuit, an electromagnetic coupling interconnection operative at microwave frequencies between first and second microwave circuit conductors in first and second different layers of said circuit, comprising a first ground plane disposed between said first and second layers, a coupling slot defined in said first ground plane, said slot having an effective electrical length equivalent to one half wavelength at a frequency of operation, said slot further having a midsection extending substantially transverse to said first and second conductors, and conductive cavity-defining means for completely surrounding said interconnection coupling slot, said interconnection ground plane and said interconnection circuit conductors with conductive surfaces defining first and second cavities, said first circuit conductor disposed within said first cavity, said second circuit conductor disposed within said second cavity, said conductive surfaces for preventing coupling to parallel plate transmission line modes.
In a multilayer microwave integrated circuit, an electromagnetic coupling interconnection operative at microwave frequencies between first and second microwave circuit conductors in first and second different layers of said circuit, comprising:
- a first ground plane disposed between said first and second layers;
- a coupling slot defined in said ground plane, said slot having a midsection extending substantially transverse to said first and second conductors, said slot having an effective electrical length equivalent to one half wavelength at a frequency of operation;
- and
- cavity-defining conductive enclosure means for defining a cavity enclosure completely surrounding said coupling slot and electromagnetically coupled portions of said first and second microwave circuit conductors to prevent coupling to parallel plate transmission line modes, and wherein said cavity enclosure defines a cavity sufficiently small to prevent formation of cavity propagation modes.
A guided missile, comprising:
- an RF processor section, said section comprising a multilayer circuit having at least first and second layers, a first microwave circuit defined in said first layer and comprising a first circuit conductor, and a second microwave circuit defined in said second layer and comprising a second circuit conductor;
- and
- an electromagnetic coupling interconnection operative at microwave frequencies between said first and second microwave circuit conductors in said first and second different layers, comprising a first ground plane disposed between said first and second layers, and a coupling slot defined in said ground plane, said slot having a midsection extending substantially transverse to said first and second conductors, said slot having an effective electrical length equivalent to one half wavelength at a frequency of operation, and conductive cavity-defining means for completely surrounding said interconnection coupling slot and electromagnetically coupled portions of said first and second circuit conductors with conductive surfaces defining first and second cavities, said first circuit conductor disposed within said first cavity, said second circuit conductor disposed within said second cavity, said conductive surfaces for preventing coupling to parallel plate transmission line modes.
In a multilayer microwave integrated circuit, an electromagnetic coupling interconnection operative at microwave frequencies between first and second microwave circuit conductors in first and second different layers of said circuit, comprising:
- a first ground plane disposed between said first and second layers;
- a coupling slot defined in said ground plane, said slot having a midsection extending substantially transverse to said first and second conductors, said slot has an effective electrical length equivalent to one half wavelength at a frequency of operation;
- and
- cavity-defining conductive enclosure means for completely surrounding said coupling slot and electromagnetically coupled portions of said first and second microwave circuit conductors to prevent formation of coupling to undesirable transmission modes.
Dependencies are inferred from the claim text.