Resin encapsulated semiconductor device with an electrically insulating support and distortion preventing member

A semiconductor device comprising:

• a semiconductor chip;
• a plurality of leads each electrically connected at one end thereof to said semiconductor chip;
• a synthetic resin portion which encapsulates said semiconductor chip and said one end of said leads;
• and
• an insulating support and distortion preventing member having a thickness larger than a thickness of each of said leads,
• another end of said leads extended outwardly from said synthetic resin portion, and
• said insulating support and distortion preventing member formed integrally with said synthetic resin portion at a root portion of said leads, which extend from the synthetic resin portion, said leads provided on said insulating support and distortion preventing member, and said insulating support and distortion preventing member made of a same material as that of said synthetic resin portion encapsulating said semiconductor device, said leads being connected to each other at said root portion only by said insulating support and distortion preventing member.

A semiconductor device comprising:

• a semiconductor chip;
• a plurality of leads each electrically connected at end thereof to said semiconductor chip;
• a synthetic resin portion which encapsulates said semiconductor chip and said first end of said leads;
• and
• an insulating support and distortion preventing member formed of a same material as said synthetic resin portion, said insulating support and distortion preventing member having a thickness larger than a thickness of each of said leads,
• a second end of said leads being similarly bent to have a gull-wing like-shape extending outwardly from said synthetic resin portion, a tip portion of said second end of said leads being further bent upwardly forming an up-bend end having a tip, said insulating support and distortion preventing member provided on said up-bent end of said leads and said insulating support and distortion preventing member located a predetermined distance from said tip, said leads being fixed to each other.

A semiconductor device comprising:

• a semiconductor chip;
• a plurality of leads each electrically connected at a end thereof to said semiconductor chip;
• a synthetic resin portion which encapsulates said semiconductor chip and said first end of said leads;
• and
• an insulating support member,
• a second end of said leads being bent to have a gull-wing like shape extending outwardly from said synthetic resin portion, and
• said insulating support member formed of a solidified material and provided on a front side of a flat bottom portion of said leads in said gull-wing like shape, said leads being fixedly connected to each other by means of said insulating support member, said insulating support member is formed with one of a) a concave portion and b) a convex portion over an entire width in a space between two adjacent said leads to enlarge a distance between said leads thereby avoiding a short-circuit by a solder bridge.