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US 5,471,096 AGranted
Solder interconnection from a composition containing a mixture of dicyanates
AssigneeInternational Business Machines Corporation
InventorsKostas I. Papathomas, Frederick R. Christie, David W. Wang
Life of this patent
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Abstract
Compositions containing bisphenol M dicyanate, prepolymer thereof, or mixtures thereof, and 4,4'-ethylidene bisphenol dicyanate, prepolymer thereof or mixtures thereof; and filler having maximum particle size of 20 microns and being substantially free of alpha particle emissions. The compositions are useful in forming interconnection structures for forming an integrated semiconductor device to a carrier substrate.
Claims17
A solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate comprising
- a plurality of solder connections that extend from the carrier substrate to electrodes on said semiconductor device to form a gap between said carrier substrate and the semiconductor device, wherein said gap is filled with a composition obtained from curing a composition containing:
- A. binder component containing
- 1) about 40% to about 70% by weight of bisphenol M dicyanate, prepolymer thereof, or mixtures thereof;
- and
- 2) correspondingly about 60% to about 30% by weight of 4,4'-ethylidene bisphenol dicyanate, prepolymer thereof, or mixtures thereof;
- and
- B. Filler having a maximum particle size of 20 microns and being substantially free of alpha particle emissions;
- wherein the amount of A is about 30% to about 50% by weight of the total of A and B and correspondingly, the amount of B is about 70% to about 50% by weight based upon the amount of A and B.
5 more elements
Dependencies are inferred from the claim text.