Platinum and platinum silicide contacts on .beta.-silicon carbide
AssigneeThe United States of America as represented by the Secretary of the Navy
InventorNicolas A. Papanicolaou
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Abstract
Gold, which is the commonly used metallization on .beta.-silicon carbide, is known to degrade at temperatures above 450.degree. C. It also exhibits poor adhesion to silicon carbide. Schottky contacts with platinum metallization have rectifying characteristics similar to contacts with gold metallization. The platinum Schottky contacts remain stable up to 800.degree. C. Adhesion of the platinum deposited at slightly elevated temperatures is also superior to that for gold. Platinum provides a metallization that is physically more rugged and thermally more stable than conventional gold metallization.
Claims9
A Schottky contact comprising metallization of platinum on n-type .beta.-silicon carbide, and an interfacial layer including PtSi, said Schottky contact being stable to catastrophic degradation of rectifying characteristics at temperatures up to 800.degree. C.
A Schottky contact metallization on silicon carbide comprising a contact layer of platinum, an interfacial layer including PtSi, a diffusion barrier layer, and a highly conducting top layer metal, said Schottky contact being stable to catastrophic degradation of rectifying characteristic at temperatures up to 800.degree. C.
Dependencies are inferred from the claim text.