Back to results
US 5,471,017 AGranted
No fixture method to cure die attach for bonding IC dies to substrates
AssigneeTexas Instruments Incorporated
InventorLinden T. Halstead
Life of this patent
Estimating the term…
Abstract
A no fixture method to cure die attach for bonding IC dies (16) to substrates in which a solvent is applied to top and bottom surfaces of a thermoplastic die attach film (14), prior to component placement of the die (16) on a lead frame die support pad or on a printed circuit board PCB (12). The die attach film (14) is bonded to the IC die (16) and the lead frame, or to the IC die (16) and the printed circuit board PCB (12) upon drying of the solvent.
Claims19
A product formed by the process of:
- providing a substrate;
- providing a die attach film;
- coating both sides of said die attach film with a solvent to soften said die attach film;
- placing said solvent coated die attach film on said substrate;
- placing a semiconductor device on said solvent coated die attach film;
- and
- allowing said solvent to dry.
4 more elements
A product formed by the process of:
- providing a substrate;
- providing a die attach film;
- coating a portion of said substrate with a solvent capable of softening said die attach film;
- coating the backside of a semiconductor device with a solvent capable of softening said die attach film;
- placing said die attach film on said solvent portion of said substrate;
- placing said semiconductor device on said die attach film;
- and
- allowing said solvent coated die attach film to dry.
5 more elements
A product formed by the process of:
- providing a substrate;
- providing a die attach film;
- coating a portion of said substrate with a solvent capable of softening said die attach film;
- placing said die attach film on said coated portion of said substrate;
- coating the exposed portion of said die attach film with a solvent capable of softening said die attach film;
- placing a semiconductor device on said die attach film;
- and
- allowing said solvent to dry.
5 more elements
Dependencies are inferred from the claim text.