Homogeneous thermoplastic semi-conductor chip carrier package
AssigneeAK Technology, Inc.
InventorWilliam H. Maslakow
Life of this patent
Estimating the term…
Abstract
A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.
Claims18
A thermoplastic chip carrier cavity package, said cavity package comprising:
- a circuit substrate which is laminated with a suitable thermoplastic in order to form a base, said base providing integral reinforcement of said circuit substrate, said circuit substrate comprising:
- a chip die mounting pad;
- and
- a plurality of lead traces each of which are located so as to provide electrical isolation from each other and said chip die mounting pad;
- a lead frame comprising a plurality of lead members each of which is attached to a different one of said plurality of lead traces;
- a casing, which is comprised of said suitable thermoplastic, said casing covering said laminated circuit substrate and said lead frame so that a cavity is formed, and said casing being chemically fused to a portion of said base of said laminated circuit substrate;
- and
- a lid which is comprised of said suitable thermoplastic and chemically fused to said cavity.
A thermoplastic chip carrier cavity package, said cavity package comprising:
- a circuit substrate which is laminated with a suitable thermoplastic in order to form a base, said base providing integral reinforcement of said circuit substrate, said circuit substrate comprising:
- an opening;
- and
- a plurality of lead traces each of which are located so as to provide electrical isolation from each other and said opening;
- a heat sink which is chemically fused to said laminated circuit substrate;
- a lead frame comprising a plurality of lead members each of which is attached to a different one of said plurality of lead traces;
- a casing, which is comprised of said suitable thermoplastic, said casing covering said laminated circuit substrate, said heat sink and said lead frame so that a cavity is formed, and said casing being chemically fused to a portion of said base of said laminated circuit substrate;
- and
- a lid which is comprised of said suitable thermoplastic and chemically fused to said cavity.
Dependencies are inferred from the claim text.