Electronic package with lead wire connections and method of making same
AssigneeInternational Business Machines Corporation
InventorsYutaka Tsukada, Yasukazu Kobayakawa, Yoji Maeda, Shuhei Tsuchita
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Abstract
An electronic package assembly wherein lead wires serve to connect conductors on a first substrate (e.g., ceramic) having a semiconductor device (e.g., IC chip) coupled to the conductors and positioned on the substrate, to respective conductors on a second substrate (e.g., a printed circuit board). The lead wires are secured to three different surfaces (e.g., top, side and bottom) of the first substrate, and include curved projection portions for being directly connected to the second substrate conductors.
Claims5
A method of making an electronic package, said method comprising the steps of:
- providing a first substrate including at least one electrical conductor thereon;
- positioning a semiconductor device on said first substrate to electrically connecting said device to said conductor;
- providing a second substrate including at least one electrical conductor thereon;
- and
- electrically connecting said conductor on said first substrate to said conductor on said second substrate, utilizing at least one lead wire, said connection accomplished by attaching said lead wire to at least three surfaces of said first substrate, said lead wire including a projection portion, said method including electrically connecting said projection portion to said conductor on said second substrate.
Dependencies are inferred from the claim text.