Polymer thick film resistor compositions
AssigneeE. I. Du Pont de Nemours and Company
InventorJay R. Dorfman
Life of this patent
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Abstract
A polymer thick film resistor composition is disclosed which comprises: (1) finely divided particles of a conductive metal having a surface area of 0.3 to 3.0 m.sup.2 /g; (2) finely divided particulate material having a surface area greater than 100 m.sup.2 /g; (3) a thermoplastic resin; dissolved in (4) an organic solvent having a volatility rating of 10,000 to 50,000; wherein the composition is substantially curable within 2.5 minutes by heating to a temperature of 135.degree. C., and further wherein the volume ratio of particulate material to resin is at least 3.5, and the weight ratio of solvent to resin is 3 to 5.
Claims12
A polymer thick film resistor composition consisting essentially of:
- (1) finely divided conductive metal particles having a surface area of 0.3 to 3.0 m.sup.2 /g,
- (2) finely divided material non-metallic particles having a surface area greater than 100 m.sup.2 /g, said particles (a) being chemically inert and (b) having a conductivity substantially less than the conductive metal, and
- (3) a thermoplastic phenoxy resin dissolved in an organic solvent having a volatility rating according to ASTM Test D 3539-87 greater than 10,000 seconds to 90% evaporation, wherein the composition is substantially cured within 2.5 minutes by heating to a temperature of 135.degree. C., and the volume ratio of non-metallic particulate material to phenoxy resin is at least 3.5, and the weight ratio of solvent to phenoxy resin is 3:1 to 5:1.
The composition of claim 7 wherein the solvent has a volatility rating of 10,000 to 50,000 seconds to 90% evaporation.
A polymer thick film resistor composition consisting of:
- (1) finely divided of electrically conductive carbon particles having a surface area greater than 100 m.sup.2 /g, and
- (2) a thermoplastic phenoxy resin dissolved in
- (3) an organic solvent having a volatility rating according to ASTM Test D 3539-87 greater than 10,000 seconds to 90% evaporation,
- wherein the composition is substantially cured within 2.5 minutes by heating to a temperature of 135.degree. C., and the volume ratio of carbon to phenoxy resin is at least 3.5, and the weight ratio of solvent to phenoxy resin is 3:1 to 5:1.
The composition of claim 19 wherein the carbon particles have a surface area greater than 200 m.sup.2 /g.
Dependencies are inferred from the claim text.