Enclosing a substrate with a heat-recoverable article
AssigneeRaychem Corporation
InventorsJames A. Rinde, Richard M. Rowe
Life of this patent
Estimating the term…
Abstract
A substrate (12,14) is enclosed with a heat recoverable backing with a layer of a thermosetting adhesive composition (20) comprising an amorphous thermoplastic resin and a thermosetting resin positioned between the heat recoverable article (10, 26) and the substrate (12,14). The adhesive composition can be in the form of a self supporting sheet or tape or it can be on a surface of the heat recoverable article (10). In some embodiments, a polymeric insert (32) is also used to ensure adequate sealing between the substrate and the thermosetting adhesive.
Claims18
A method of enclosing a substrate comprising:
- (a) positioning a heat recoverable article around the substrate;
- (b) positioning a flexible layer of a thermosetting adhesive composition between the heat recoverable article and the substrate to be enclosed, said adhesive composition
- (i) comprising a blend of (1) about 25 to about 45 parts by weight of the adhesive composition of an essentially amorphous thermoplastic resin selected from the group consisting Of polysulfones, polyethersulfones, polystyrene, polyphenylene oxide, amorphous polyamides, phenoxy resins, amorphous polyimides, polyetherimides, polyetherimide/silicone block copolymers, polyurethanes, polycarbonates, and acrylic resins such as polymethyl methacrylate, styrene/acrylonitrile and styrene block copolymers, and (2) about 75 to about 55 parts by weight of the adhesive composition of an uncured thermosetting resin, and
- (ii) being such that it will remain substantially uncured for at least about one year at 25.degree. C.;
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- (c) heating the article and adhesive to cause the article to recover toward the substrate and the adhesive to cure, thereby enclosing the substrate.
An article of manufacture comprising a heat recoverable article having on a surface thereof a flexible layer of a thermosetting adhesive composition which
- (a) comprises a blend of (i) about 25 to about 45 parts by weight of the adhesive composition of an essentially amorphous thermoplastic resin selected from the group consisting of polysulfones, polyethersulfones, polystyrene, polyphenylene oxide, amorphous polyamides, phenoxy resins, amorphous polyimides, polyetherimides, polyetherimide/silicone block copolymers, polyurethanes, polycarbonates and acrylic resins such as polymethyl methacrylate, styrene/acrylonitrile and styrene block copolymers, and (ii) about 75 to about 55 parts by weight of the adhesive composition of an uncured thermosetting resin;
- and
- (b) is such that it will remain substantially uncured for at least about one year at 25.degree. C.
A method of enclosing a substrate comprising:
- (a) positioning a heat recoverable article around the substrate;
- (b) positioning a flexible layer of a thermosetting adhesive composition between the heat recoverable article and the substrate to be enclosed, said adhesive composition
- (i) comprising a blend of (1) about 25 to about 45 parts by weight of the adhesive composition of an essentially amorphous thermoplastic resin selected from the group consisting of polysulfones, polyethersulfones, polystyrene, polyphenylene oxide, amorphous polyamides, phenoxy resins, amorphous polyimides, polyetherimides, polyetherimide/silicone block copolymers, polyurethanes, polycarbonates, and acrylic resins such as polymethyl methacrylate, styrene/acrylonitrile and styrene block copolymers, and (2) about 75 to about 55 parts by weight of the adhesive composition of an uncured thermosetting resin, and
- (ii) being such that it will remain substantially uncured for at least about one year at 25.degree. C.;
- (c) positioning a polymeric insert between the thermosetting adhesive layer and the substrate to be enclosed;
- and
- (d) heating the article, the thermosetting adhesive, and the polymeric insert to cause the article to recover toward the substrate and the thermosetting adhesive to cure, thereby enclosing the substrate.
Dependencies are inferred from the claim text.