Apparatus and method for spreading resist on a wafer and detecting bubbles in the resist
AssigneeChartered Semiconductor Manufacturing Pte Ltd.
InventorSoon E. Neoh
Life of this patent
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Abstract
A station for coating a semiconductor wafer with a photoresist is provided with a detector for bubbles that may occur in the resist that is supplied to the wafer. The resist is carried to the coating apparatus by a plastic tube. A commercially available capacitance detector is positioned to detect the dielectric constant of the combination of the tube, the resist, and any bubbles in the resist. The dielectric constant of the bubbles is lower than the dielectric constant of the resist, but the difference is not sufficient for detecting the bubbles with the capacitance detector alone. A metal backing plate is located on the side of the tube opposite the detector and enhances the operation of the detector sufficiently to detect bubbles of various sizes.
Claims6
In an apparatus for spreading a resist on a semiconductor wafer including a supply of a resist having a predetermined dielectric constant, a nozzle for applying the resist to the wafer, and a tube made of dielectric material carrying the resist from the supply to the nozzle, and a bubble detector for bubbles in the resist flowing in the tube, wherein the improvement comprises said bubble detector comprising,
- a capacitance sensor having electrode means for establishing an electric field in a subject to be tested and having a circuit for signaling the dielectric constant of the subject, and means mounting the capacitance sensor on one side of the tube and near the tube to sense the dielectric constant of the combination of the tube, the resist in the tube, and any bubbles in the resist,
- and a metal backing plate located near the tube on the side of the tube opposite the capacitance sensor, the backing plate of a thickness to form an electrical ground for the capacitance sensor.
A method for spreading a resist coating evenly on a wafer, wherein the resist coating is adversely affected by bubbles in the resist, the method comprising the following steps,
- providing a resist station including a resist nozzle and a means for holding the wafer to receive resist from the nozzle,
- providing a resist supply and creating a flow of the resist from the resist supply through a resist delivery line to the nozzle, the resist being subject to bubble formation that may interfere with the resist coating,
- monitoring the flow of the resist through the delivery line with a capacitance sensor located on one side of the delivery line and a conductive plate of a thickness to form an electrical ground for the capacitance sensor located near the capacitance sensor and on the side of the delivery line opposite the sensor,
- and stopping the spreading of the resist on the wafer if bubbles in the delivery line are detected during said monitoring step.
Dependencies are inferred from the claim text.