Modular floor sub-structure for the operational support of computer systems

A floor module for use in assembling a floor supported substructure configured to support a computer system component having given operational heat generation and power consumption characteristics, comprising:

• a frame having a rectangular bottom surface and four side panels extending therefrom to an edge portion defining four corners and vertically oriented outwardly disposed and inwardly disposed side surfaces, said side panels having access openings formed therein;
• a tile supoprt mounted upon and extending along said edge portion and having an upwardly disposed support surface;
• a vertically adjustable floor engaging foot component mounted to said frame in the vicinity of each said corner;
• at least one floor tile positionable upon said frame, having a downwardly depending peripheral bearing surface abuttably engageable with said support surface and defining a cavity with said frame;
• and
• a blocking panel removably connectable with said side panel at said inwardly disposed side surface to cover an adjacent said access opening.

A floor supported substructure assemblage for a computer system component having a given base peripheral configuration with a base region through which heat removing air may pass, said system component having given operational heat generation and power consumption characteristics, comprising:

• a plurality of floor modules, each having a lower portion supported upon said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a discrete chamber intermediate said lower portion and said elevated floor surface, said floor modules being arranged in a said assemblage of predetermined peripheral geometric shape including a linear side portion;
• a said floor module having a said side portion forming said assemblage linear side portion and having a cooling coil mounted within the said discrete chamber thereof connectable with cooling fluid conduits, and located within an input air path extending to an air intake adjacent thereto;
• a step assembly supported upon said floor, having a riser portion extending upwardly a step height less than said floor module given height to a step surface, and defining a step cavity therewithin, said assembly being positioned in abutting adjacency with said assemblage linear side portion;
• said cooling fluid conduits being located within said step cavity and coupled with said cooling coil;
• the said elevated floor surface of a said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication with said base region;
• a said floor module discrete chamber retaining an air circulation blower having an input for receiving air from said input air path and an air flow output;
• and
• an air flow path defined by at least one said discrete chamber extending from said blower air output to said air outlet.