Thermoplastic polymer particles in liquid thermosettable resin
AssigneeMinnesota Mining and Manufacturing Company
InventorsGene B. Portelli, William J. Schultz, John T. Boden, Daniel M. Kaufer
Life of this patent
Estimating the term…
Abstract
A thermosettable resin composition is prepared by admixing a liquid mixture of thermosettable resins such as a polyepoxide and amorphous thermoplastic polymer particles such as a polyetherimide to form a homogeneous cured resin composition. The particles have an average diameter of from 0.5-50 micrometers, a surface area of at least 1.0 m.sup.2 /g, a dissolution temperature of at least 50.degree. C., and are essentially insoluble in the thermosettable resin at temperatures of up to 15.degree. C. below the dissolution temperature but are completely dissolved at a temperature of at least 20.degree. C. below the cure temperature of the resin.
Claims20
A process for preparing a hot melt coatable thermosettable resin composition comprising the steps of:
- providing an admixture comprising
- a) a thermosettable mixture that is liquid at a temperature in the range of 20.degree. to 100.degree. C. comprising one or more thermosettable resins and one or more curatives for the thermosettable resins and
- b) resin particles of one or more amorphous thermoplastic polymers, said particles being dispersed in the thermosettable mixture at a temperature below the dissolution temperature of the particles, the particles having an average diameter in the range of 0.5 to 50 micrometers, a surface area of at least 1.0 m.sup.2 /g, and a dissolution temperature of 50.degree. C., or higher and being essentially insoluble in the thermosettable resin at temperatures up to 15.degree. C. below the dissolution temperature;
- said resin composition being free of solvent for the thermoplastic particles and having a viscosity that decreases with increasing temperature up to a dissolution temperature and that increases with increasing temperatures at temperatures above the dissolution temperature, said amorphous particles being capable of completely dissolving in the thermosettable resin at a temperature at least 20.degree. C. below the cure temperature of the resin, and being capable of providing a homogeneous cured resin composition.
Dependencies are inferred from the claim text.