Copolyamide melt adhesives for heat sealing textiles
AssigneeElf Autochem Deutschland GmbH
InventorsEduard de Jong, Karl-Heinz Hapelt
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Abstract
The use of copolyamides as melt adhesive for heat sealing is disclosed. At least three monomer components are copolymerized in the copolyamide. These monomer components are selected from the following group: an equimolar mixture of adipic acid and hexamethylenediamine (6,6 salt), lauric acid lactam, 11-aminoundecanoic acid, an equimolar mixture of azelaic acid and hexamethylenediamine (6,9 salt), an equimolar mixture of sebacic acid and hexamethylenediamine (6,10 salt) and an equimolar mixture of dodecane dicarboxylic acid and hexamethylenediamine (6,12 salt), the melting point of the copolyamide being lower than 140.degree. C. and at least 10% by weight of lauric acid lactam and/or 11-aminoundecanoic acid being copolymerized.
Claims8
A copolyamide composition as a melt adhesive for heat sealing characterized by being free of caprolactam and in that
- A) at least three of the following monomer components are copolymerized within the copolyamide:
- a) an equimolar mixture of adipic acid and hexamethylenediamine (6,6 salt)
- b) lauric acid lactam
- c) 11-aminoundecanoic acid
- d) an equimolar mixture of azelaic acid and hexamethylenediamine (6,9 salt)
- e) an equimolar mixture of sebacic acid and hexamethylenediamine (6,10 salt
- f) an equimolar mixture of dodecane dicarboxylic acid and hexamethylenediamine (6,12 salt)
- B) the melting point of the copolyamide is lower than 140.degree. C. and
- C) lauric acid lactam and/or 11-aminoundecanoic acid are copolymerized into the copolyamide in an amount of at least 10% by weight, the total amount of components a) to f) constituting 100% by weight.
Dependencies are inferred from the claim text.