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US 5,458,912 AGranted
Tamper-proof electronic coatings
AssigneeDow Corning Corporation
InventorsRobert C. Camilletti, Loren A. Haluska, Keith W. Michael
Life of this patent
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Abstract
Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
Claims13
A method of forming a tamper-proof coating on an electronic device comprising:
- applying a coating composition comprising a silica precursor resin and a filler onto an electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device;
- and
- heating the coated substrate in a non-oxidizing atmosphere at a temperature sufficient to convert the coating composition into a ceramic coating.
Dependencies are inferred from the claim text.