Method for bonding a porous medium to a substrate
AssigneePall Corporation
InventorsDavid B. Pall, Brian T. Muellers
Life of this patent
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Abstract
A method for bonding a porous medium to a substrate is provided which includes contacting a porous medium with a surface of a substrate, impregnating the porous medium with a bonding composition, maintaining the impregnated porous medium in contact with the substrate surface until the substrate surface is at least slightly dissolved in the bonding composition without dissolving the porous medium, and passing the bonding composition through the impregnated porous medium towards the substrate and subsequently away from the surface of the substrate to remove bonding composition containing dissolved substrate from a portion of the porous medium to minimize blockage of pores in the porous medium.
Claims20
A method for bonding a porous medium to a substrate comprising:
- contacting a porous medium with a surface of a substrate;
- impregnating the porous medium with a bonding composition which at least slightly dissolves the substrate surface without dissolving the porous medium;
- maintaining the impregnated porous medium in contact with the substrate surface until the substrate surface is at least lightly dissolved in the bonding composition;
- flushing at least a portion of the bonding composition through the impregnated porous medium towards the substrate and subsequently away from the surface of the substrate to remove bonding composition containing dissolved substrate from a portion of the porous medium to minimize blockage of pores in the porous medium;
- and
- evaporating the bonding composition from the substrate and the porous medium.
A method for bonding a porous medium to a substrate comprising:
- contacting a porous medium with a surface of a substrate;
- impregnating the porous medium with a bonding composition;
- maintaining the impregnated porous medium in contact with the substrate surface until the substrate surface is at least slightly dissolved in the bonding composition without dissolving the porous medium;
- and
- passing the bonding composition through the impregnated porous medium towards the substrate and subsequently away from the surface of the substrate to remove bending composition containing dissolved substrate from a portion of the porous medium to minimize blockage of pores in the porous medium.
A method for bonding a porous membrane to a substrate comprising:
- contacting a dry porous nylon membrane with a dry surface of a polyethersulfone substrate;
- contacting the porous membrane with a compressible, porous pad;
- applying a bonding composition, which includes methylene chloride and methanol, to the pad and transferring at least a portion of the bonding composition from the pad to the porous membrane, thereby impregnating the porous membrane with the bonding composition;
- maintaining the impregnated porous membrane in contact with the substrate surface until the substrate surface is at least slightly dissolved in the bonding composition without dissolving the membrane;
- flushing at least a portion of the bonding composition through the impregnated porous membrane toward the substrate and subsequently away from the surface of the substrate through interconnecting grooves in the surface by applying a vacuum to the substrate surface to remove bonding composition containing dissolved substrate from a portion of the porous medium add minimize blockage of pores in the porous medium;
- and
- then evaporating the bonding composition from the substrate and the porous membrane by applying a vacuum to the substrate and the membrane, thereby removing the methylene chloride more rapidly than the methanol such that the bonding composition no longer dissolves the substrate.
Dependencies are inferred from the claim text.