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US 5,457,149 AGranted
Reworkable adhesive for electronic applications
AssigneeMinnesota Mining and Manufacturing Company
InventorsJoyce B. Hall, Peter B. Hogerton, Jean-Marc Pujol
Life of this patent
Estimating the term…
Abstract
Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing temperature.
Claims10
An adhesive composition comprising:
- (a) an amount sufficient to provide a reworkable adhesive when blended with other components of a thermoplastic polymer having a T.sub.g of 30.degree. C. to 250.degree. C., said thermoplastic polymer selected from the group consisting of:
- polysulfones, polyimides, polycarbonates, and polyethers;
- (b) an amount sufficient to provide a reworkable adhesive when blended with other components of a crosslinkable resin having a T.sub.g of 125.degree. C. to 300.degree. C.;
- (c) a catalyst capable of accelerating the cure reaction of said crosslinkable resin;
- wherein said adhesive composition has a cure time of from 5 to 300 seconds, at a temperature of from 125.degree. C. to 250.degree. C., and when cured, said adhesive composition is a reworkable adhesive having a T.sub.g of 100.degree. C. to 200.degree. C., and having a shear strength of less than 1 MPa at a temperature of 20.degree. C. above the T.sub.g of said reworkable adhesive, and a modulus of greater than 100 MPa at a temperature of 20.degree. C. below the T.sub.g of the cured reworkable adhesive.
2 more elements
An adhesive composition comprising:
- a) an amount sufficient to provide a reworkable adhesive when blended with other components of a thermoplastic polymer having a T.sub.g of 30.degree. C. to 250.degree. C., said thermoplastic polymer selected from the group consisting of:
- polysulfones, polyimides, polycarbonates, and polyethers;
- b) an amount effective to provide a reworkable adhesive when blended with other components of a crosslinkable resin having a T.sub.g of 125.degree. C. to 300.degree. C.;
- c) a catalyst capable of accelerating the cure reaction of said crosslinkable resin;
- wherein said adhesive composition has a cure time of from 5 to 300 seconds, at a temperature of from 125.degree. C. to 250.degree. C., and when cured, said adhesive composition is a reworkable adhesive having a shear strength of less than about 1 MPa at a processing temperature, T.sub.p, in the range of about 125.degree. C. to 250.degree. C., and a modulus of greater than 100 MPa at a qualifying temperature, T.sub.Q, in the range of about 80.degree. C. to 150.degree. C., wherein T.sub.Q is less than T.sub.p.
2 more elements
Dependencies are inferred from the claim text.