Micromachining methods for making micromechanical moving structures including multiple contact switching system

A micromachining method for fabricating a micromechanical electric switch comprising the steps of:

• providing an electrically-insulative base having a generally planar surface;
• forming a patterned first conductive layer on the base, portions of the patterned first conductive layer comprising stationary switch contacts;
• applying a cavity-supporting polymer dielectric layer to the base and over the patterned first conductive layer thereon;
• exposing the stationary switch contacts by forming at least one cavity extending through the cavity-supporting polymer dielectric layer;
• conformally depositing a lining sacrificial layer within the at least one cavity and over the cavity-supporting polymer dielectric layer;
• conformally forming a second conductive layer over the lining sacrificial layer such that at least one portion of the second conductive layer within the at least one cavity can serve as at least one movable switch contact;
• and
• releasing the second conductive layer for axial movement of the at least one movable switch contact within the at least one cavity relative to the cavity-supporting polymer dielectric layer by employing a selective etch to remove the lining sacrificial layer.

A micromachining method for fabricating a micromechanical electric switch comprising the steps of:

• providing an electrically-insulative base having a generally planar surface;
• forming a patterned first conductive layer on the base, portions of the patterned first conductive layer comprising stationary switch contacts;
• applying a cavity-supporting polymer dielectric layer to the base and over the patterned first conductive layer thereon;
• exposing the stationary switch contacts by forming a plurality of cavities extending through the cavity-supporting polymer dielectric layer;
• conformally depositing a lining sacrificial layer within said cavities and over the cavity-supporting polymer dielectric layer;
• conformally forming a second conductive layer over the lining sacrificial layer such that portions of the second conductive layer within said cavities will serve as movable switch contacts;
• and
• releasing the second conductive layer for axial movement of the movable switch contacts within said cavities relative to the cavity-supporting polymer dielectric layer by employing a selective etch to remove the lining sacrificial layer.